Electronics Forum | Wed Oct 06 21:45:20 EDT 1999 | John
I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement b
Electronics Forum | Tue Mar 06 08:33:40 EST 2007 | cardinal
You can get a topside edge-clamping system to fit your AP HI E printer from Gridlok. They make a universal tooling system and topside edgeclamping system for the AP series and UP 2000 series printers. The Y snugger tooling option when ordered with t
Electronics Forum | Fri Dec 12 12:01:44 EST 2008 | realchunks
As the technology has changed towards surface mount, so has the applying adhesive. In the past clinching parts would have knocked off SMD parts, but no that has all changed. So applying the adhesive via screen print is common and any thru-hole part
Electronics Forum | Fri Dec 19 10:18:05 EST 2008 | dyoungquist
On TH parts we have been hand soldering. This last summer we purchased a Rhythm selective solder machine from RPS automation. I did a factory tour of both RPS and ACE since both facilities are about 1/2 mile from each other. In comparing the 2 c
Electronics Forum | Tue Jul 14 07:37:31 EDT 2009 | tony_d
Hello Reese, We currently own two MIRTEC MV-3 desktop machines and one MV-7 inline machine (so you can tell right away that I am a little biased.) We had an opportunity to evaluate both the YESTech and MIRTEC machines on our production floor. The
Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko
| | I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme
Electronics Forum | Fri Oct 08 16:48:24 EDT 1999 | Charles Morris
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Wed May 15 12:55:11 EDT 2002 | fmonette
Hi Dave, The short answer is "not any significant amount" of moisture is removed during reflow. The temperature excursion is much too short. If you look at the physics of moisture diffusion inside a package you will see that only the surface moist
Electronics Forum | Mon Jul 20 12:39:11 EDT 2009 | bigdaddysoy9
Hello Reese, Lifted leads are and have always been a big concern for us. We were using a system that had 12 cameras total. 8 angled and 4 top-down. I could not get that to catch lifted leads without having a ton of false calls. I thought that may
