Electronics Forum | Mon Apr 16 14:33:50 EDT 2001 | dason_c
Consider to use micro via 10 mil or less, it may help to prevent any solder/flux reflow to the other side and affect your next printing operation. Also, solder void need to be under consideration. Dason.
Electronics Forum | Tue Apr 17 21:01:56 EDT 2001 | davef
Just click on the Practical Components box on the left side of this page [Hey, whereditgo? Oh well, use http://www.practicalcomponents.com/]. It will be right fine.
Electronics Forum | Thu Jul 20 14:46:00 EDT 2000 | Jeanette
All the sources of information that I have read so far mentions PTH boards, has this process been tried with single sided PCB's? If it has what were the results.
Electronics Forum | Thu Jul 20 12:22:33 EDT 2000 | Jeanette
I am just starting to investigate the fesability of this process and have very limited knowledge. Is there any problems inserting components on the same side as the paste on a PTH. When a component is inserted in this way is there a problem with th
Electronics Forum | Tue Jun 06 18:36:21 EDT 2000 | Mohsen Esmailpour
Which direction is the industry moving to for cooling high-end electronic devices/boards? Is there anything innovative taking place beyond liquid cooling and refrigeration? Is anyone developing cooling techniques which are integral part of the devic
Electronics Forum | Wed May 30 10:35:54 EDT 2001 | traviss
Do you have vacuum on your printer? I guess not or you wouldn�t be asking. Can you get vacuum? If not you could use double sided tape, I am always amazed how many times it can stick before it needs replaced.
Electronics Forum | Fri Jul 13 05:25:03 EDT 2001 | surachai
I would like to know about the efficiency of hot air knife debridging option with wave solder machine ,anyone use this option please suggestion to me about yield ,side effect or profitable of this option . Thanks.
Electronics Forum | Wed Jan 26 07:40:15 EST 2000 | Dave F
Dennis: We stepped stencils on the board side to accomidate additive jumpers. They work fine. The steps are not close enough to affect fine pitch devices. Please describe how the stencil is sffected in the area of your FP devices. Dave F
Electronics Forum | Tue Dec 21 15:16:48 EST 1999 | Christopher Cross
We had the same concern and decided to use 0603 components on the bottom of the board only if we reflowed both sides of the board.
Electronics Forum | Mon Dec 20 16:58:24 EST 1999 | Dave F
David: We build boards with BGAs wall to wall on both sides. May the issue you're concerned about is the thermal characteristics of your fabricated board. Good luck. Dave F
