Electronics Forum: side (Page 221 of 507)

Panasonic 08x04 Feeders Paper -vs- Emboss

Electronics Forum | Thu Jul 15 13:41:23 EDT 2004 | Claude_Couture

We use paper tape in green emboss feeder without problems. But you can't use emboss tape in white paper feeder because the bottom of the tape needs a channel so the tape is supported on two side. Also, we remove all push pins. they are useless. We ne

driving triacs in power supply

Electronics Forum | Sat Jul 24 06:00:50 EDT 2004 | zlatkon

I need to build regulated power supply 0-30V 0-20 Amps. The only solution possible for minimizing the thermal loss is to use triacs on the secondary Trafo side in order to cut the sine for low voltage output and great current. (like 5V, 20A). Please

Inspection criteria on PIH parts

Electronics Forum | Wed Aug 04 17:16:13 EDT 2004 | Richard

Can anyone comment on inspection criteria for PIH applications. I'm of the opinion that the inspection criteria used for wave soldered joints should be used for PIH. Some colleagues believe that a bottom side fillet is not necessary since the solde

Conductive ink protection

Electronics Forum | Wed Sep 01 22:09:25 EDT 2004 | raylrhodes

We have an up coming job that has conductive ink deposits on the solder side of the PCB for contact switches and a zebra strip that connects to an LCD display. My question is... Do these need to be masked to protect them from the wave solder process

DEK vs EKRA

Electronics Forum | Fri Oct 01 13:14:10 EDT 2004 | dorklover664

The MPM's are the Yugo's. You can fix anything on it with duck tape and a rubber band. I would go with the DEK. They are user friendly and reliable. Just make sure that if you are running double-sided boards to look into good push-up pins. They have

Stencil Tension

Electronics Forum | Tue Oct 26 00:49:42 EDT 2004 | pilengr_tw

Yes, we have an SOP on how to measure. Basically, calibrate the measuring device and measure tension on the 4 sides and one at the center of the stencil. All measurement should be within 30 ~ 50 N/cm otherwise we will not use it and return it to sten

SOIC FAIL

Electronics Forum | Tue Oct 26 16:55:12 EDT 2004 | davef

More background please: * What is the condition of failure [eg, part damaged, part poorly attached, etc] * You mention heel and side fillets. What about under the component? * Are the components properly attached? Or are they floating on a bed of fl

CP43 Placing problem on PLCC28

Electronics Forum | Wed Nov 24 05:57:31 EST 2004 | chad

If you're using tooling pins, you may check to see that they do not have wear on the sides from boards repeatedly rubbing against them. I have seen this problem several times, you may give it a look. If you're not using them, I'd suggest that you gi

BGA Via Tenting

Electronics Forum | Fri Jan 21 19:30:11 EST 2005 | Dreamsniper

Hi T2, The purpose of this is that we want to make our rework robust. Whenever we rework BGA's we have solder getting trapped into those 1 sided tented vias and bet yah...they are hard to desolder! And during BGA resoldering these trapped solder will

BGA's, 0402's and HASL Boards

Electronics Forum | Wed Dec 22 12:36:36 EST 2004 | rlackey

Hi Mark, Look on the bright side, if you want to change from HASL you've got the lead free issue which will allow you to evaluate all other finishes, and find the best one for you. Dave, have you seen any unleaded HASL finishes & any issues arising


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