Electronics Forum: side (Page 331 of 507)

Re: BGA rework : IR or convection

Electronics Forum | Wed May 12 10:38:51 EDT 1999 | Glenn Robertson

| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, My experience is primarily wi

Re: BGA rework : IR or convection

Electronics Forum | Tue May 18 03:03:34 EDT 1999 | Philip B.

| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | My experience i

Re: Design guidelines for solder thief pads

Electronics Forum | Fri May 07 15:37:22 EDT 1999 | JohnW

| This is not strictly a surface mount query but any input welcome | I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last t

Re: Problems with Ceramic Capacitor SMD In-Circuit Test

Electronics Forum | Thu May 06 01:37:56 EDT 1999 | Kallol Chakraborty

| I would like to know if someone aleady have problems with Ceramic Capacitors SMD in In-Circuit Test (see below)and how did you solve this problems ? | | PROBLEMS | 1 - Only one kind of capacitor (2n2F), of all capacitors on board, sometimes are o

Re: Delamination

Electronics Forum | Tue Apr 27 13:58:15 EDT 1999 | Scott McKee

| Board Experts | | I am fighting with a board house about a delamination problem.. First the facts | 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. | 2) 150 Boards with this part number built with the same reflow oven settings (2

Re: Delamination

Electronics Forum | Tue Apr 27 17:22:40 EDT 1999 | Dave F

| Board Experts | | I am fighting with a board house about a delamination problem.. First the facts | 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. | 2) 150 Boards with this part number built with the same reflow oven settings (2

Re: Paste-in-Hole

Electronics Forum | Fri Apr 23 04:02:22 EDT 1999 | Scott Davies

I need to know if there are any special component pad designs that need to be considered when evaluating paste-in-hole? We have a few through hole connectors that are good candidates to place pre reflow. Does anyone have sugguestions. Thanks Chri

Re: chip shooter

Electronics Forum | Fri Apr 16 01:19:10 EDT 1999 | Wiratsr

Hi Jeff, I didn't have experience with Pansert MV2-E, but I have MV2-F. The machine running in high speed, but very noisy. I have other machine Sanyo TCM-3000 Same speed with MV2-F. Sanyo is original design turret system, a stable mounting machine,

Re: Intrusive soldering

Electronics Forum | Thu Mar 25 14:00:45 EST 1999 | Bob Willis

| Rob, | | We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: | | - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. | - Apply adhesive dots

DEK fine pitch autoflex pin breakage

Electronics Forum | Fri Mar 19 19:05:27 EST 1999 | Earl Moon

Folks, I think we are getting closer to being very happy with DEK stencil printers of the 265 GSX variety. However, problems continue arising concering fine pitch autoflex tooling pin breakage. We are told by the British engineering establishment,


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