Electronics Forum: side and tray and feeder(stf-100s (Page 1 of 1)

BGA and QFP orientation in trays for pick and place

Electronics Forum | Thu Jan 15 12:55:03 EST 2004 | James

Polarity in tape and reel is usually always on the bottom left side. And that is correct for the trays, they have a corner taken out where the polarity goes. Hope that helps........

Waffle Tray Handling and Storage

Electronics Forum | Fri Feb 23 08:28:11 EST 2007 | James

I just wanted to know if anyone stores their vacuum sealed bags on their sides instead of flat. We are trying to save room, but I dont want to create defects either. The ones we have are tightly vacuum sealed and would like to store on their sides

Re: BGAs and vapor phase

Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko

| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to som

Re: SMT Pick and Place

Electronics Forum | Sat Jun 13 00:25:59 EDT 1998 | Scott McKee

Last October I purchased a Mydata over a Phillips and Amistar. I've done things on my Mydata that is impossible on the other machines. I can build the top side and the bottom side of two boards at the same time (I print both sides at once). I can "

Re: BGAs and vapor phase

Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko

| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi

Re: BGAs and vapor phase

Electronics Forum | Mon Jul 19 11:50:47 EDT 1999 | Mario

| | Hi, SMTASSY | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | First, we do not do real series produktion, only prototyping up to sometimes 20 uni

Fuji CP6 and IP3 specifications request

Electronics Forum | Fri Aug 05 08:15:39 EDT 2016 | jdengler

The IP3 specs are: PCB Dimensions Max: 508 mm x 457 mm - Min: 80mm x 50mm Thickness: 0.8 to 4.0mm Component Capacity Tape: 74 - 8/12mm Device Locations Tray: 40 Locations Placing Rate: 0.55 sec/component for small chips 1.25 sec/component for ICs

Integration of manual odd form / low volume pick and place

Electronics Forum | Wed Aug 28 10:51:27 EDT 2002 | edmentzer

We use a manual "pick and place" unit similar to the OK product, and it work great. The parts are in a tray and the operator moves the pick up head over the part and press down which turns on the vacuum, the vacuum is turned off when the part is pla

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