Electronics Forum | Sun Oct 31 23:58:54 EST 1999 | John A.
Do both sides of that board contain larger IC's and other large components or just one side?? If just one side contains large components, try running the side with the smaller components first, and then run the other side last. If that doesn't work
Electronics Forum | Thu Jun 23 08:58:00 EDT 2005 | Irene Taylor
We are defining a new assembly process for a double sided card that has 26 BGAs on the top side and 14 BGAs on the bottom side. We currently have one double sided BGA board with one BGA per side and have to epoxy one BGA (35mm X 35mm - 352 ball count
Electronics Forum | Thu Jun 23 14:13:52 EDT 2005 | Frank
Luckily I haven't needed to do very many bottom side BGA placements. But I have also heard of trying to use a higher temp solder for bottom side only and your normal solder for the top side. This way the bottom side solder doesn't get hot enough to
Electronics Forum | Tue Dec 26 15:22:43 EST 2000 | Hussman
Vickij, Why not try using regular temp. paste for both sides? Unless you have some real heavy parts on both sides, you can run a double-sided reflow process with most boards. I myself like to place R's and C's first (or bottom side) and then do an
Electronics Forum | Tue Jun 13 21:53:31 EDT 2000 | Dave F
This site is dedicated to double sided reflow and solder balls. Wasssup?
Electronics Forum | Wed Apr 26 06:43:21 EDT 2000 | Sal
Guys We currently produce a number of PCB's which are reflowed on the top side and glued on the bottom side, and the current process is to build the top side and reflow then glue and cure, is this approach correct ? or should we be curing then reflow
Electronics Forum | Wed Apr 26 10:59:54 EDT 2000 | Jose Baez
Sal: You are Correct running firts the reflow side then glue side. In my Experience I've seen a reverse procesess( first glue"cure" and then reflow side) but the quality results were not good, because We realized the Glue tent to cristalise and when
Electronics Forum | Sun Oct 31 19:39:26 EST 1999 | Pat Copeland
Parts are falling off on first side when reflowing second side, have tried changing temp profiles, and ended up using tin foil. any recomendations.
Electronics Forum | Wed Jun 03 08:51:07 EDT 1998 | Pat Copeland
Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only be
Electronics Forum | Thu Apr 11 11:32:23 EDT 2002 | barryg
Hello everyone. We are interested in doing double sided surface mount. What methods are there for doing this. I know you can wave solder some smt components, but what are the limitations. Is there a method of doing this that uses 2 different solder p
