Electronics Forum | Fri Aug 25 09:01:42 EDT 2006 | russ
We sire don't AJ, We use a single large aperture in center and the outer pads are just reduced our standard which is I believe about mil off of each side or 2 mils in X and Y. As far as side fillet, sometimes we get them sometimes we don't, I attri
Electronics Forum | Fri Aug 25 10:29:13 EDT 2006 | Chunks
With tacky flux, the BGA is not as reliable as one that was never repaired. I believe Dave stated that the higher offset may have something to do with it. Also with tacky flux, the ball collapse form side to side varies a bit. Sometimes a ball(s)
Electronics Forum | Thu Sep 14 11:56:47 EDT 2006 | russ
I think you have your pitch wrong but anyway, I have never had success with wave soldering anything less than 50 mil pitch. On a QFP I have had good luck on three sides of 25 mil but never all four sides and without defects. Mask 'em off and hand s
Electronics Forum | Fri Sep 22 07:02:12 EDT 2006 | basem
Thanks Rob. Our concern is placing tiny components side by side at a minimum pitch, along with fairly large BGAs and TSOP2, which are themselves, having small to fine pitch leads. yes, accuracy in placement in our application is crucial, yet, what i
Electronics Forum | Tue Oct 31 08:08:15 EST 2006 | bobsavenger
I'm just looking for some fire-power here. We have a board that when it goes through reflow the first time, everything is fine and has good wetting. When we do the secondary side, one specific part is then Dewetting according to our production oper
Electronics Forum | Mon Nov 27 13:36:24 EST 2006 | cyber_wolf
The fluid heats up to 105-110 from the ultrasonics running, and or from the fluid filtering pumps. The rinse temp is always the same as the wash. It is a single tank with a partition welded in between. (One side rinse, and the other side wash) FYI
Electronics Forum | Thu Nov 30 12:23:31 EST 2006 | John S.
Lou, There's nothing like working with it yourself. We went through this exercise several months ago. We evaluated MIRTec, YESTech, and MVP. We were looking at benchtop units, so all 3 companies were willing to send in a "demo" unit for 3 weeks.
Electronics Forum | Sat Dec 23 01:00:38 EST 2006 | mika
Of Course you can. We have a customer specific board that has a stupid connector underneith, and we must manually glue this one onto it's postition before reflow on the secondary side first... And as you know, the customers is alwayw left... The funn
Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39
When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.
Electronics Forum | Tue Jan 23 15:20:59 EST 2007 | stepheniii
On the Ekra those are called top clamps AKA finger slicers. With the Ekra side clamping means there is nothing on the top of the board. Does your printer have true side only clamping? Or do you need the top finger slicers for the grid-lok to work r
