Electronics Forum | Fri Jul 13 17:01:50 EDT 2007 | sean10
Thanks for your inputs. The board construction seams to be balanced and boards comes back to flat after top side process. we'll be performing experiement variing the profile parameters. if that does not do it, any printing suggestings? Would more sq
Electronics Forum | Thu Jul 26 23:43:49 EDT 2007 | gioblast
check your stencil design on the ground pad. You might have a big aperture opening that pushing the component away from the paste. Look alos the way your pcb warp. Prioritize side that has component that need flat pcb as much as possible. hope this h
Electronics Forum | Fri Jul 27 15:51:29 EDT 2007 | hussman
Well I agree with jdumont in the fact that you should reduce the center pad at least 50%. Generally the sides of the leaded ends are not plated and solder will not wick up. This means only the bottoms of the leads wil solder. Look in this area whe
Electronics Forum | Thu Aug 02 18:42:02 EDT 2007 | grantp
Hi, The thing is I don't see, even if this was a viable process, how it would be better. It's still multiple layers of copper with components on one side of it. It's the same as what we do now, but just much more complex to build? Grant
Electronics Forum | Tue Jul 31 14:09:12 EDT 2007 | realchunks
We buy a years worth of the 3M stuff and attatch the cost to a new customer. Guess there could be new and improved stuff out there, but without customer service, who's gonna buy it? Easier to go with what works. What's a "yin"?
Electronics Forum | Tue Jul 31 20:08:35 EDT 2007 | davef
"Yins" means "yall." It could be "yinz" also. Look here: http://www.urbandictionary.com/define.php?term=yins
Electronics Forum | Wed Aug 15 13:46:04 EDT 2007 | hussman
But in the REAL world where the part hits the board, all the software in the world can't predict part size descrepancy, polarity descrepancy, thickness error, or board tollerance errors.
Electronics Forum | Wed Aug 22 22:07:53 EDT 2007 | mdm4ua
Easy fix is put a drop of washable mask on the side of part before reflow. The mask dries before the solder reflows and holds the part in place. After reflow it washes away.
Electronics Forum | Mon Aug 13 09:07:47 EDT 2007 | pavel_murtishev
Good morning, Does BGA pin configuration allow to add one glue dot? Is you PCBA populated with BGAs from both sides? BR, Pavel
Electronics Forum | Mon Sep 17 14:45:10 EDT 2007 | jeffharley
Are you using adjustable workboard holders or dedicated ones? Are both heads lined up exactly the same(using the b.e.c. template? Are parts formed correctly and lined up with the component holes on both sides(heads)?
