Electronics Forum | Fri Mar 09 08:25:13 EST 2001 | CAL
We have seen some problems with component end cap solder terminations not being symetrical. i.e. If one end on the cap has a larger solder ternination this sometimes is enough surface area during reflow to lift the opposite side of the component. We
Electronics Forum | Wed Mar 14 21:05:59 EST 2001 | davef
Mike makes a very good [ no, make that excellent!!!] point about reflowing solder at the same time you are curing glue. There is some evidence that the outgasing during the cure of glue can affect the LT reliability of solder connections. [Regardles
Electronics Forum | Fri Mar 16 17:50:45 EST 2001 | djarvis
Steve, I did this several years ago on a terribly designed board that left a lot of joints unsoldered after the wave. It works OK. This was a bog Irish board with nothing fancier than SOP packages. Glue was Amicon D125. Happy St. Patrick's Day everyo
Electronics Forum | Fri Apr 13 14:51:01 EDT 2001 | Mike R.
Some Selective wave solder jig designer milled down the jig in one depth which is based on the thickest part on the bottom side of the board. This will create problem on the warpage on the jig due to the heat coming from the wave soldering machine. I
Electronics Forum | Mon Apr 16 12:31:27 EDT 2001 | mparker
If, after all the good advice already given, the engineer insists on following his wacky design, you may still be able to influence some success. First you have the fab house plug the via holes with solder then you make sure that the bottom side of
Electronics Forum | Thu Jul 20 15:02:31 EDT 2000 | Mike McMonagle
Bob, Could you outline the processes used for this seemingly impossible assembly technique? Whenever mentioned, most folks shake their heads and look at me like I'm delusional (not true since I started my new medication, hehehe). Of course they're th
Electronics Forum | Thu Jul 20 14:31:20 EDT 2000 | Bob Willis
The process is not that difficult so have a go as soon as possible. Take a board wipe some paste on a board stick the part in and run it through the reflow process. Don�t worry about balling just see what you get first, that what I did first ! The m
Electronics Forum | Mon May 07 17:59:07 EDT 2001 | davef
One thing I forgot to add about the globs of solder on your bottom side SMT components after wave soldering: The excess solder is likely reducing the reliability of these components, because of the difference in CTE betweeen the ceramic base on the
Electronics Forum | Thu May 31 10:21:16 EDT 2001 | davef
On "Flip Chip/uBGA Under-fill Visual Standards" � The third "Satisfactory" [The under-fill if by design should be visible � ], here the notation "if by design" is unclear. Does "according to product documentation" get to the point? The first "Acc
Electronics Forum | Wed May 30 15:40:14 EDT 2001 | davef
Slappy, Most of our discussions about flex came before the last great SMTnet.com server transition that destroyed the archives. Consider custom building carriers with tooling holes, vacuum line holes, alignment pins, multiple layers, etc. from uncl
