Electronics Forum | Tue Mar 09 18:21:37 EST 1999 | Stan Levitsky
We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce br
Electronics Forum | Mon Mar 08 10:02:11 EST 1999 | Steve Beck
Hello; I am looking for general info on backplane assemblies. Any info would be appreciated, but some of the questions that come to mind include: -What part types other than connectors do backplane cards have on them? SMT? Leaded? Quantity? Is
Electronics Forum | Fri Feb 19 16:36:19 EST 1999 | Cunli Jia @ SMTnet
Bob, Printing pages using Landscape is our recommended solution. We have had to accept the incovenience of printing when trying to maximize the usage of the screen area. Also, since we are not using frames, one can not print just the message. Tha
Electronics Forum | Wed Mar 31 20:34:45 EST 1999 | Peter
| Bob, | | Printing pages using Landscape is our recommended solution. We have had to accept the incovenience of printing when trying to maximize the usage of the screen area. Also, since we are not using frames, one can not print just the message
Electronics Forum | Wed Feb 10 18:17:46 EST 1999 | Earl Moon
| Hi, | | Has anyone found any significant differences on profiling using populated and unpopulated boards? Is it worth sacrificing a board to the profile gods? | | Joe | What's the cost of not doing it. In the same breath, why not wait for a sc
Electronics Forum | Fri Feb 05 09:39:58 EST 1999 | Dave F
| Can anyone help me with the pros and cons of trying to wave | solder tantalum and large (1812) ceramic capacitors. I do | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what proble
Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Mon Jan 25 13:56:45 EST 1999 | Parvez Patel
Chang Hong while developing our CSP rework process, we found a temperature spread of about 130C at a distance of approx 150 mils from the component edge. our nozzle had about 20 mils clearance from all sides of the component being reworked. depending
Electronics Forum | Wed Jan 20 08:58:42 EST 1999 | Clifford Peaslee @ SMTnet
| Clif: | | For the past few weeks I have found that the latest postings do not show up when I enter the forum. Once I go and clear the history (cookies) they do show up. | | Not too sure what the problem is, most likely it is on my side of the fe
Electronics Forum | Thu Dec 10 13:27:36 EST 1998 | Dave F
| Dear everybody : | Does anyone have some information about "bleeder pad"? it seems a method to avoid solder shorts across very small SMT pads.If someone have any idea about it, please contact with me , thanks ! | Young: I'm unfamiliar with the
