Electronics Forum | Mon Aug 16 16:57:06 EDT 2004 | Shean Dalton
Try to observe the board as it exits the wave, look for solder snapping as the leads finally exit the solder. The surface tension could be such that a "string" of solder stretches away from the wave until it finally breaks. Then, as the string reco
Electronics Forum | Thu Oct 21 04:21:55 EDT 2004 | siverts
Have been through this before and we resolved our problem as follows: 1.Make sure that the length of your board support pins on Your HSP is correct. On that machine the board support pins depends on the board thickness (+ - some tenth's of a mm). It'
Electronics Forum | Wed Aug 18 06:34:57 EDT 2004 | Bernard Mulcahy
Hi , Our hardware designer wants to introduce a board with a straddle - mounted SMT connector, AMP part number 84487-1 and FCI 71292-001. This is an 80 pin connector that slips over the edge of the PCB and has 40 SMT pads on either side (at least thi
Electronics Forum | Thu Aug 19 05:12:41 EDT 2004 | bernardmulcahy
Hi Russ, Thanks for the reply -- It is not a double sided board so I guess I will be doing pretty much the same process as you described. I was wondering about was the tool you mentioned -- Is this just a fixture you got made locally or some specific
Electronics Forum | Tue Aug 24 12:20:33 EDT 2004 | davef
The methods Terry mentioned are good, but our operators are too impatient. Here's how they do site prep, after removing the BGA: * Use a soldering iron to melt the solder at the base of the ball. * Flick the ball[s] from the pad[s] with the solderin
Electronics Forum | Fri Sep 24 13:38:16 EDT 2004 | Nick Prince
The re-use of any component has commercial implications as weel. If you check the data sheet for the component in question you will find the reflow profile, usually there will be a "Max No of Reflows". I have never seen this number higher than 2. If
Electronics Forum | Wed Sep 08 20:48:28 EDT 2004 | Darby
Yes I agree with Russ about someone asking up front and everything else. Two tips. 1. Keep the marks at least 5mm in from the conveyor edges of the pcb so that clamping systems do not hide the mark. 2. Make sure the marks are eccentric around the pcb
Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly
hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare
Electronics Forum | Tue Sep 14 03:14:52 EDT 2004 | Adam
Hi Has anyone see a defect,where after one pass over the wave, pins on conectors seem to have a tenancy to have a mimimum solder fillet on the bottom-side of the board. There seems to be no trend, It could range from half a dozen to two dozen from b
Electronics Forum | Thu Sep 16 21:46:16 EDT 2004 | jeremyt
I work for a major OEM as well, and we have close to 1000 stencils in house. We just recently went to a new way of labeling our stencils. We ordered metal ID tags out of McMaster, and assigned a Number to each stencil. We then attached each tag to t
