Electronics Forum: sided (Page 311 of 507)

BGA Warping at the corners

Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb

My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed

SMT solder Covering component surface

Electronics Forum | Mon Jul 01 13:19:55 EDT 2013 | emeto

I always look for a toe fillet if the design allows you to. Many times the pad design is close or exactly the size of the leads which makes people to touch it up right away. I told them hundred times not to but...Luckily I have 3D x-ray and I can tel

SD Card holder solderability

Electronics Forum | Mon Jul 01 11:29:02 EDT 2013 | hegemon

I am guessing a lead free process. From the pictures, I don't neccessarily see any issues, perhaps the leads have wicked up a little too much solder, making the joint look a little starved. But I think I see nice toe and side fillets. In the worst c

solder joint problem

Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006

We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing

Juki Operator Maintenance

Electronics Forum | Thu Sep 12 09:29:22 EDT 2013 | ericrr

The person who told me the information was the "technical" partner who used to own half the company, & owned the machine and rented back to the company, about the time he retired, who had has hand in more than one electronic industry pie, over his wo

Mydata TM8FC Feeder strange issue

Electronics Forum | Wed Feb 05 21:03:35 EST 2014 | padawanlinuxero

On top of the feeder should be a small cover thats adjustable you need to unscrewed a little and move it forward to the pick up area this should give you enough space to cover the other component another thing you can try is check if all the feeder

Underfilled BGA Removal

Electronics Forum | Mon Sep 28 09:23:03 EDT 2015 | slave2anubis

Hi, sorry for reopening a old thread, but i wanted to ask if there is a way to know at what temperature the solder melts if you have a chip with underfill? I thnk its lower then normal air-fill temperature since the underfill conducts heat better the

Samsung SM421/F Optimized Feeder List

Electronics Forum | Sun Apr 13 02:36:06 EDT 2014 | alexeis

Hi, We have system called Setup Center for Samsung that can give a solution to your needs. It loads samsung files, including before and after optimization, and gives you feeder list splitted by machine and side (Front/Rear). Also, you can go over on

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak

what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal

Lite-On side looking LED assembly problems

Electronics Forum | Thu May 29 14:48:45 EDT 2014 | olek

On one of our designs, we use LEDs Lite-On/LTST-S110TB (SMD). PCB footprint was designed according to manufacturer's recommendations. However, our vendor has problems with assembling these parts. Some parts are tilted, other have bad solder joints or


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