Electronics Forum: sided (Page 356 of 507)

Achieving High Yields with CSP

Electronics Forum | Thu Aug 26 10:28:07 EDT 1999 | Stuart Adams

What are the key steps to achieving high yield with CSP ??? (We are trying qualify vendors for volume fab/assembly of some products which use several CSP devices on each side of the board. (Some with 0.5mm ball pitch)) Looking through the forum I

Re: Achieving High Yields with CSP

Electronics Forum | Fri Aug 27 13:24:19 EDT 1999 | swsng

| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Thu Aug 26 04:22:26 EDT 1999 | JAX

| | | | | | | Hello everyone, | | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Than

Re: BGA device continuity testing of solder connections

Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon

| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce

Re: Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 08:14:38 EDT 1999 | Peter Barton

| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous

Re: Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 10:00:45 EDT 1999 | Boca

| | Ladies and Gentlemen, | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav treme

Re: Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 13:00:08 EDT 1999 | Earl Moon

| | | Ladies and Gentlemen, | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav

Re: Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 13:25:09 EDT 1999 | ScottM

| | | | Ladies and Gentlemen, | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I wou

Re: oven ventilation requirements

Electronics Forum | Wed Aug 04 16:55:32 EDT 1999 | Doug

| We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough t

Re: sm ic's

Electronics Forum | Sat Jul 24 23:18:00 EDT 1999 | Scott McKee

| We are going to smt ic's on the component side of our pcb's. | The problem is we are going to have to do this by hand. | We have a hot air station and vac pencil, but How reliable is this process. | We've tried it on proto's and had some shorting p


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