Electronics Forum: sided (Page 386 of 507)

MPM AP25 Print Repeatability Problem

Electronics Forum | Fri Sep 22 12:21:06 EDT 2006 | daxman

We are using the Universal tooling..the one with the side plates. I'm not sure what the C-tool is. The machine did not come with much. I'm running the vision system test now..I've never done it before..but I'll let you know what happens with it. To

Dek MK1

Electronics Forum | Sat Oct 21 19:25:42 EDT 2006 | Ola

I assuming that you already have checked the fuses? Also, check all the power: +5V, +12V, +-24V, etc. We had to change our PSU once, after a major power-drop due to a thunderstorm. But you should be ok if you can pinpoint what type of voltage you are

Soldering Iron Questions

Electronics Forum | Sun Nov 05 23:01:53 EST 2006 | Sxsxcx

ok, sorry ,750 was deg F and which I said 350~400 were deg C, I got a mistake. As I know, we use 660~720 deg F to do reworking for lead free solders such as SAC series and SnCu0.7 series solder to protect irons and components on boards. when temp.

Need input on cracked caps/new reflow

Electronics Forum | Tue Nov 07 18:18:03 EST 2006 | Andrea

I am wondering how to move from hand soldering our ceramic caps to doing a reflow type process. The reason for the change is too many cracked ceramic caps. I have asked our vendors to assemble our boards via reflow but because of our hardware (swaged

The Most Difficult BGA Rework EVER!!

Electronics Forum | Wed Nov 08 08:48:45 EST 2006 | markhoch

Okay, here's the deal-e-o....I need to find the Nation's Best BGA Rework Specialists. I have 50 PCBs each measuring about one square inch, that need to have a BGA Ring Socket Removed, eight capacitors removed, and a new ring socket installed. Sounds

SnPbAg solder paste at reflow oven

Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip

It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.

Design rule for vias

Electronics Forum | Wed Dec 06 21:28:12 EST 2006 | davef

It's worse than just using the test equipment manufacturer guidelines. Along with that, you have to deal with each of the test fixture fabricators' preferences as well. What this boils down to is a negotiation with the test engineering group as to w

Yield on 0402 SMT Printed Circuit Board Assemblies

Electronics Forum | Thu Jan 04 20:31:21 EST 2007 | Ben_T

Have you thought about an AOI system? With the system we have where I work, I'm able to run queries that'll tell me DPMO, yield, and pass/fail rates on a board level, part level, and opportunity level. Furthermore, this data can be broken down to see

simple doubt about reflow profile

Electronics Forum | Mon Feb 12 13:16:35 EST 2007 | CK the Flip Guy

Looks good at first glance. Couple of questions, though: Time Above _____. Fill in the blank. Is Liquidous 183C (Tin-Lead) or 217C to 220C (Lead Free)? The "soak" of 150-190, at 0.6*C per second ramp up looks good, weather it's lead or lead-free

SMT on Flexible circuits

Electronics Forum | Fri Feb 16 06:47:38 EST 2007 | CL

vshan, We were using pallets (delmat with cavities for the flex) We put stips of double sided Kapton tape in the critical areas. The tape held up to the heat and kept the circuit flat for the QFP's and BGA's. We based our assembly process for this c


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