Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F
Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens
Electronics Forum | Tue May 26 07:46:26 EDT 1998 | Peter H. Cote
We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C
Electronics Forum | Fri Mar 06 23:09:11 EST 1998 | Scott Cook
| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need
Electronics Forum | Tue Jan 13 13:39:30 EST 1998 | Matt Brown
| I am currently producing a Charity Report for The SMART Group on DSRS which the Group will sell and all the money goes to Charity. Does any one know of any good articles they can send me on double sided reflow assembly ? | I feel that there are onl
Electronics Forum | Thu Jun 13 11:24:25 EDT 2002 | davef
Sorry to hear about the Quality Department thing, but we all have our cross to bear, eh? Through an extended period, say 8 hours, understand change of critical controls in the following: * Conveyor speed. * Side to side temperature differences. * Ti
Electronics Forum | Mon Oct 15 13:41:49 EDT 2001 | bschreiber
Hi Dale, I have copies of the articles of which Mike references. If you need copies for support, contact me at: bill@smartsonic.com. Rinsing should be done by ultrasonics also. Spray in atmosphere systems will not penetrate into the same tight ar
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Sat Aug 03 08:44:11 EDT 2002 | P. Kannan
We are having 3 MPM UP-2000 printer & 1 AP-25 printer with us. I would like to have the technical guidance for my following application. For one of our model, there is a requirement of Glue & solder paste on same side of the PCB. Currently we are u
Electronics Forum | Wed Oct 30 10:26:42 EST 2002 | Randy V.
I would perform a simple solderability test per ANSI/J-STD-002. You can do this using a compatable no-clean flux like Indium NC771 and a solder pot. If the leads wet well you do not have a solderability problem. I did not notice what plating was on t
Electronics Forum | Fri Nov 08 05:08:28 EST 2002 | zolasteven
Can anyone advise on the following : 1. Insufficient pcboard support during printing We are printing on double sided pc boards (approx. 8 ins by 6 ins). There is a problem of high paste when we are printing the second side. The reason bsing the boa
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