Electronics Forum | Thu Jul 23 22:50:38 EDT 1998 | Steve Gregory
Hey youse guyz... We're finally getting our first real job at the start-up I'm working at. It's actually a pretty unique little board too. Simple as all get out, but unique. You're not gonna believe what this goes into...guess? (I bet ya' you'll neve
Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef
All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Wed Oct 30 16:05:08 EST 2002 | msimkin
Hi, I have received a report form a board supplier, analysing the reuslts form non wetting problems we have been expereincing with their boards. I assumed it was due to the gold layer being too thin, thus allowing the nicklel layer to be exposed and
Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W
There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.
Electronics Forum | Wed Aug 18 00:53:16 EDT 2004 | Grant
Hi, I think you cannot go wrong with Convection. If you want to experiment with VP, just get some of the fluid and put it into a pasta cooker on a standard domestic hot plate. Have a basin full of cold water so after reflow you can lift the cooker a
Electronics Forum | Thu Dec 22 21:29:05 EST 2005 | davef
Josh: Room Temperature Vulcanizing (RTV) is Dow Corning's trade name for it's family of silicone cure sealants. RTV is about the worst kind of coating there is. Its chemistry is highly ionic and it requires atmospheric humidity absorbed to "complete
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Thu Jan 18 20:58:10 EST 2007 | davef
Check with your component suppliers. For instance, look at the paragraph at the bottom of page 4 here: http://www.national.com/ms/PA/PACKING_CONSIDERATIONS__METHODS__MATERIALS_AND_REC.pdf We have no relationship, nor receive benefit from the compa
Electronics Forum | Mon Jul 23 11:44:40 EDT 2007 | davef
NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons processed at the same time and under the same conditions as the PWA. The coupon substrate may be any compatible rigid material with a smooth flat surface.
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