Electronics Forum: silver and plating and tarnishing (Page 1 of 1)

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman

Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.

Imm Silver and Voiding

Electronics Forum | Tue Jun 27 12:12:05 EDT 2006 | GMan

Yes it does seem like a plating issue and analysis is being done. Thank you for your inputs.

Silver Epoxy and CEM3

Electronics Forum | Wed Aug 26 12:02:23 EDT 1998 | Steve Joy

Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve

Imm Silver and Voiding

Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman

Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN

We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer

Re: Silver Epoxy and CEM3

Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson

| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic

Re: Silver Epoxy and CEM3

Electronics Forum | Thu Aug 27 17:40:11 EDT 1998 | Earl Moon

| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve Steve, Hello again. Hope you guys (Intel) aren't going to do that

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef

First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so

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