Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Electronics Forum | Mon Jan 15 15:00:11 EST 2001 | pr
It is the distance between board and stencil. When your stenciling solder paste you usually want to contact print (which is "0" snapoff). When you are stenciling adhesive you can affect your dot size and quality by using a gap between board and stenc
Electronics Forum | Sat Jan 06 11:39:56 EST 2001 | Steve Thomas
On a related note, I'm wondering if any of the newer devices have any way to factor in paste not releasing from the corners, or for that matter, radiused, oval, or round apertures. We have an LSMII, and all it does it let you draw a rectangle around
Electronics Forum | Thu Dec 21 19:24:25 EST 2000 | Alejandro Rodriguez Gallegos
Hi Sorry my poor english We have some problems with some componentes 0402 we recived by the manucterer oxide in the tape reells exactly in the bottom side to the reel I think the root cause is the oxide in the tapes rells What do you think? And ot
Electronics Forum | Mon May 21 04:37:41 EDT 2001 | Bob
Hi, Kris You mean you have checked the tape&component demension,all in spec, But could you tell me the spec of the tape cave size,I mean how about the gap between the cave and component? Do you have such spec.for 0402 Component? Please inform us
Electronics Forum | Mon Oct 23 21:18:14 EDT 2000 | Dave F
Unlike components where the solder paste has been reflow soldered, wave soldered components have an "infinite" amount of solder available to make a solder connection. If you have good solder flow, pad and component termination size are going to be b
Electronics Forum | Wed Oct 11 12:52:10 EDT 2000 | Antonio A. Medina
Hello all, I'm new at this so forgive me if my question seems common knowledge to everyone else. I've searched the archives but found no clear answer to what exactly is aspect ratio and what the best ratio is. All I really know is that it has to d
Electronics Forum | Sat Sep 30 12:14:32 EDT 2000 | jarnopy
Hi Maybe you have too small apertures in stencil. Good apertures size is 90% from pad. And one thing what you can try is that you cut your stencils(blades) aperture corners round (i mean like a oval). I hope that these advices can help you.
