Electronics Forum: size (Page 41 of 349)

Missing component benchmarking

Electronics Forum | Thu Mar 14 23:20:05 EST 2002 | alanwilson

Missing and misplaced components could be down to board supports set too high or too low. Check the ZO and make sure the deflection is set ok at various points across the board. Check the other usuals such as sticking nozzles, correct size nozzle for

VIA HOLES ON SOLDER PAD

Electronics Forum | Tue Aug 06 22:20:32 EDT 2002 | Computer

Hi , I am currently faced with a problem with the via hole on the component pad. The customer does not allow plugging of the hole and enlarging the stencil pad hole size or thicker stencil size may cause bridging to the component next to it.

Big Board Production

Electronics Forum | Tue Aug 20 13:33:03 EDT 2002 | gregp

Contact Systems 3 series placement machines have a standard board size of 18 X 26 but machines have been made with a 24 X 26 board size as well. We have several different models to chose from depending on your budget and throughput requirements. Visi

through hole reflow

Electronics Forum | Tue Oct 01 15:48:56 EDT 2002 | lysik

No problem. A standard stencil is OK. You want to print a half moon shape on each side of the hole. Make sure you print about X2 the size of your hole and make sure you keep the print in close to the hole. You want to print X2 the hole size as to hav

BGA dead bug pick and place

Electronics Forum | Tue Oct 29 05:22:38 EST 2002 | kent

Thankyou very much for the information. Another question, what are the difficulty of dealing with the larger ball and tighter pitch? What is size of the ball is consider large and how far the distance for pitch is consider tight? Currently I have

Flip chip or wire bond?

Electronics Forum | Fri Jan 03 16:14:37 EST 2003 | Jacques Coderre

Hi Jon, Flip Chip is chosen as an interconnect approach when one needs improved performance (high pin count, high frequency, noise reduction or improved heat dissipation.Another driver is size...Flip Chip greatly reduces the area and therefore is cho

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark

What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended

Stencil Design for Resistor Net Array 0402

Electronics Forum | Wed Mar 26 19:11:52 EST 2003 | russ

Tell us more about your printer. squegge blade type ,speed, snap-off distance etc... You shouldn't have to change apertures for any component based upon its rotation. the parts that are coming out good could they withstand a higher volume print? You

Package Dimensions

Electronics Forum | Fri Jun 27 15:37:02 EDT 2003 | caldon

Charlie- You answered your own question...1206, 0201, 0603, 0805, 0402 are all the package dimensions. In addition Here is a generic link from practical components that list most package sizes, feeder size, tape type... http://www.practicalcomponen

die comparitors

Electronics Forum | Tue Sep 30 02:11:05 EDT 2003 | msimkin

We are having a problem with one of our chip sets. We have had a sudden change in performance, detrimenatally, and we beleive it may be a result of a change in die size. we need to prove this. Does anybody know a good contact or company who specialis


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