Electronics Forum: size (Page 46 of 349)

Bottomside SOT23 opens & DOE test board layout

Electronics Forum | Thu May 24 16:45:57 EDT 2001 | kmorris

Hi All: We�ve got a problem here with opens on bottom side wave soldered SOT23s. Based on past experience and review of the SMTnet archives, I feel that our main problem is pad size. We have the same size pads for bottom side SOT23s as we have for

Re: Standard pad sizes for reflow and wave

Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW

| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz

Re: Standard pad sizes for reflow and wave

Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin

| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s

Re: Standard pad sizes for reflow and wave

Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 12:25:34 EDT 1998 | Wayne

Vacuum Bakeout Ovens For many years vacuum bakeout ovens have been used in the hybrid industry for removal of moisture from ceramic cercuits prior to hermetically sealing packages. In this process the vacuum oven certainly reduces the bakeout cycle

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny

Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif

Paste Dispensing

Electronics Forum | Thu Jan 10 22:55:24 EST 2002 | davef

You are sure taking you sweet time getting this thing running. You're getting too much beach time. NOZZLE SELECTION Typically, the only rule of thumb that applies to choosing the correct nozzle ID is that it should be one half of the required dot d

Re: Glue Witness Pattern Verifiable by FUJI???

Electronics Forum | Thu Dec 07 16:15:47 EST 2000 | JAX

It doesn't matter because on a dual dot both dots should be the same size. If one of the dots is to small and is not read by the vision system the dot is bad and the board will be skipped. You don't have to read the dual dot as a single item. With th

Re: Stencil for 10 mils IC

Electronics Forum | Mon Nov 13 08:24:03 EST 2000 | G. English

Richard, From your description of the IC, as Wolfgang indicates it sounds like a 20mil pitch device, the aperture design really depends upon your solder paste particle size, we use a type 3 solder paste with a mesh size of �325 / +500microns. This is

Re: D-Pak misalignment Problem

Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron

Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad


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