Electronics Forum | Fri Jun 02 19:43:40 EDT 2000 | Ravi Bhat
One of my customers has asked about concerns, comments, ideas about putting 0402 packages on bottom side of the board. The process will be no clean with reflow/reflow. If anybody out there has some experience or concerns please comment. Regards
Electronics Forum | Tue Jun 06 17:20:05 EDT 2000 | Travis Slaughter
There is no difference in 0402�s on the bottom side than 0603 0805 1206. They will not fall off or tombstone, unless they where before you put them in the oven.
Electronics Forum | Fri Jun 02 19:42:40 EDT 2000 | Ravi Bhat
One of my customers has asked about concerns, comments, ideas about putting 0402 packages on bottom side of the board. The process will be no clean with reflow/reflow. If anybody out there has some experience or concerns please comment. Regards
Electronics Forum | Sun Jan 26 21:09:32 EST 2003 | Grant Petty
Hi, Ok, thanks for the info, and I had not considered that factor. Is this an issue related to the reflow temperature change in the oven, or a temperature change in normal product use issue? I will check out the standard, and do you know where it's
Electronics Forum | Tue Jun 14 18:26:32 EDT 2005 | GS
You can find useful informations also on last review of IPC-7085 : Design and Assembly Process Implementation for BGA. Regards GS
Electronics Forum | Tue Jun 21 11:46:04 EDT 2005 | kenscj
Hi dave, Thanks for the comment. I have another issue. The board already pass Test and Burn-In processes, but after 2 months the BGA contact is found open (no contact on certain balls). How can that happen? Is it during build, the solder ball alrea
Electronics Forum | Tue Dec 19 07:16:56 EST 2006 | Nuno
There is many Bond dispenser that have the Option to check the area & adjust in case of NG area . You just make the value of area & interval for check and correct . The Ones that I know is Panasonic HDF (great Output 0.07 tact time ) And Fuji GL5 ser
Electronics Forum | Tue Dec 19 08:14:47 EST 2006 | davef
We agree with Chunks. You need to fix your machine. Tell us about: * Temperature inside machine when glue pipes well and went glue pipes poorly * Pressure on cylinder when glue pipes well and went glue pipes poorly
Electronics Forum | Wed Dec 20 07:54:13 EST 2006 | davef
We pipe a nonfunctional witness mark on every board. We inspect the witness mark. Ours consists of six pairs of dots arranged in a five-pointed star pattern. Again, consider paying attention to the cause of the problem. Your machine is NOT operat
Electronics Forum | Tue Dec 19 04:04:52 EST 2006 | ec
Hi, I been facing this problem in the past...... Now, I have change to printing. In the past, glue dotting is my bottom neck and need to use 2 glue dotting machine....and now, with printing proces, no more bottom neck in glue process and quality als