Electronics Forum | Fri Aug 03 01:44:38 EDT 2007 | pavel_murtishev
Good morning Steve, What does optimizer say? What is the error generated by optimizer? Could you tell me exact error optimizer gives? Topaz ties to fit all feeders mechanically into the feeder plate when optimization starts. Optimizer generates an
Electronics Forum | Mon Aug 13 11:24:57 EDT 2007 | jimmyjames
If you're getting that kind of error it's most likely that your feeder bank hasn't been told that the stick feeders can be placed on the back of the machine, or like they said in earlier posts, the stick feeder size itself may be incorrect in the sof
Electronics Forum | Wed Nov 07 13:00:41 EST 2007 | jdumont
Hello all, we are having issues with some specific package type aluminum caps we use while running lead free. We used to run these leaded with none of these issues. Basically we are not getting more than 25% hole fill on these parts. I have tested di
Electronics Forum | Wed Nov 07 13:36:20 EST 2007 | jdumont
Hello all, we are having issues with some specific package type aluminum caps we use while running lead free. We used to run these leaded with none of these issues. Basically we are not getting more than 25% hole fill on these parts. I have tested di
Electronics Forum | Thu Nov 08 10:26:12 EST 2007 | slthomas
"1/2 of the paste volume is lost from the flux and carriers being removed during the reflow." Don't forget the intersticial space between your solder spheres that you lose during reflow. Not being of an engineering background I couldn't begin to a
Electronics Forum | Fri Nov 30 19:39:51 EST 2007 | mika
Hi chs, What type of QFN or MLF package are we talking about? Assuming there is a middle thermal pad? Body Size & no. of terminals & pitch? What about your statement: "This package is so sensitive to any external force". Can you please explain what y
Electronics Forum | Wed Dec 05 07:25:22 EST 2007 | realchunks
All posters here are right. My point was you have to design your board to the process. You cannot simply take any connector and change it to Pin and Paste. So much depends on your aperture openings, hole size to pin size, board thickness, number o
Electronics Forum | Thu Dec 20 12:05:46 EST 2007 | realchunks
Not you Steven. Blanket comments like "Double pass printing for solder paste is not needed and will cause defects. Redesign your stencil thickness or aperture sizes, change your paste mesh size or type, go to 45 degree blades." are so way off base.
Electronics Forum | Fri May 23 16:38:28 EDT 2008 | wayne123
Well if you are getting bridges under, one thing that we used to do was flood the part with flux and then run it back through the reflow. Keep in mind we were not a High reliability manufacturer. This practice didn't hurt OUR boards, and most of the
Electronics Forum | Thu May 28 15:54:45 EDT 2009 | elmerito
Hello, We have designed a 160ball bga substrate. Now we want to use the same substrate for the 145ball version of the product. All are the same, the package size, ball pitch, solder ball size only the number of balls will change. We will use a new s
