Electronics Forum: slightly (Page 11 of 71)

MPM Accuflex fails to initialize powered rail

Electronics Forum | Mon Jul 21 06:18:15 EDT 2014 | digar

We had this. The anti-backlash nuts were binding. > We took them apart, chased the threads with a tap > and re-assembled with slightly less pre-load. > Hasn't been a problem since. > We had this. The anti-backlash nuts were binding. > We took t

Speedline Accuflex issue

Electronics Forum | Thu Jul 07 11:52:25 EDT 2016 | proceng1

We just pulled a Speedline Accuflex printer out of storage. After programming a board and stencil, and calibrating the fiducials and everything, we do a test alignment and bring the board to print height. It is off. I've done it now with two diffe

LED lifted soldering defect

Electronics Forum | Wed Dec 04 12:42:04 EST 2019 | dunks

We currently use Kester's ep256 as well and it seems to be a bit more grainy than one would expect from lead, especially if the temperature is too low. That paste says it's specialty is being robust over a wide range of profiles and stencil conditio

R0402 very high fail rate while placing

Electronics Forum | Tue Nov 08 22:49:41 EST 2022 | jojoled

Hi, I need help with placing 0402 resistors 90% of them are picked correctly, but are not placed(thrown away) giving me error : LASER retry over. Slightly higher varistors in same package have slightly better placing rate, about 50%, but still not su

Re: Recommended DPAK land pattern is too small...???

Electronics Forum | Tue Nov 14 23:49:37 EST 2000 | DL

Our land patterns are slightly bigger than the part, we've had no problems. There are your own concerns about the part hanging over the pads, this can be ok or not depending on your application and/or how much part is over. I'm sure this is in the J-

Re: Shorts in corners of BGA devices

Electronics Forum | Fri Jun 23 08:52:16 EDT 2000 | Dave F

John: Seek your answers in the archives. As I recall someone said: � Biggest cause of BGA shorting was out-gassing in-package moisture. � Removing shorts w/o removing the device: - Preheat the board - Lower the nozzle and heat the device - Lift the

Wavesoldering

Electronics Forum | Thu Mar 15 21:29:06 EST 2001 | davef

That you can solder the test points with a little extra flux and a good blast of heat makes me think there is nothing fundamentally wrong. I'd guess there is oxidation on some test points that is a little crustier than others. You might be able t

Re: Machine dropout on SOT23 device

Electronics Forum | Tue Jan 25 17:01:42 EST 2000 | Robert Steltman

Dave Thanks - have changed to a slightly larger one and it has helped quite a bit, but I feel it is still not perfect. I think I am going to write this one off to a pachaging problem on this one particular device. It is a new machine (2 weeks old) w

Elimination of Silk Screen

Electronics Forum | Mon Oct 11 12:44:37 EDT 1999 | Mike Demos

In a cost-reduction effort, our Design group is attempting to eliminate silk-screen (legend ink) on some new products. By the elimination of this process, there will be a slight decrease in the cost of the bare board. Presently, the silk screen den

Re: no-clean mask for gold fingers

Electronics Forum | Mon Jan 25 13:51:07 EST 1999 | Parvez PAtel

Steve i agree with u. we use kapton tapes for test puproses at our facility and they do not interfere with the printing results. Infact we sometimes use it to mask off unwanted apertures on stencil underside. But could their applcation affect the gol


slightly searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

Benchtop Fluid Dispenser
Pillarhouse USA for Selective Soldering Needs

High Precision Fluid Dispensers
Software for SMT

World's Best Reflow Oven Customizable for Unique Applications
Assembly Automation Technology

Find a wide selection of nozzles, solder materials, storage solutions and more at SALESCON