Electronics Forum: slump (Page 1 of 12)

solder paste volume spread

Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef

Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli

Solder bridging on IC leads

Electronics Forum | Mon Aug 23 03:12:57 EDT 2010 | grahamcooper22

Possible route causes of bridging on fine pitch ICs are; too much paste (stencil aperture wrong), poor print quality (paste smudges during printing), pcb pads not flat depending on the solderable coating, paste has poor cold slump properties, too muc

Components Solder Short

Electronics Forum | Fri Jul 21 13:34:54 EDT 2006 | fredericksr

hot/cold slump, print misregistration

Bridging Problems

Electronics Forum | Fri Mar 14 08:38:15 EDT 2008 | davef

Pastes from different suppliers have different hot slump characteristics

Re: Misalignment during reflow

Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F

Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed

Un-Reflowed Paste

Electronics Forum | Wed Jul 28 17:46:13 EDT 2004 | Steve Stach

Both temperature and humidity can cause solder paste to behave in a way to cause these formations. Temperature can cause slumping, slumping spreads out the paste, upon reflow perimeter paste does not join the bulk, and because of insuffient oxide

Lead Free Solder Paste Evaluation

Electronics Forum | Wed Apr 08 07:16:21 EDT 2009 | arrowvale

We have just switched to Almit (www.almit.com)LFM48 W TM-HP-S lead free solder paste. In general terms it is an easy printing paste, with great slump properties, wide reflow process window and offers excellent solderability on all pcb / component pa

Re: Reflow Profile Dry Out Stage

Electronics Forum | Wed Dec 13 14:37:06 EST 2000 | Chris

I should explain that this bake out was performed after population. The solder paste slumped terribly after this bake out. However, after the back out and after reflow, no bridging.

Re: Dispensing Paste On 20 Pitch Pads

Electronics Forum | Thu Aug 24 13:31:41 EDT 2000 | Dr. Ning-Cheng Lee

For 20 mil pitch applications, two important properties to evaluate are (1) dispensing volume consistency, (2) slump performance. As to the dispensing equipment, positive displacement will be the better choice for better consistency. Nozzle size is v

Misalignment during Reflow

Electronics Forum | Thu Nov 18 00:13:09 EST 1999 | Thomas

10% slump). I am finding out their test std used but I think those lab test is different from real reflow as the heat transfer rate of reflow oven is much higher. Any one care to share your views?

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