Electronics Forum: smd (Page 46 of 132)

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 12:45:12 EDT 2005 | pjc

Your not going to find the document for "guarantee" becuase none exist as far as I know.

Library for all SMD packages with dimensions

Electronics Forum | Mon Oct 31 08:47:27 EST 2005 | jdengler

IPC-7351 is the most complete I have found but is still missing some. Look here http://www.ipc.org/contentpage.asp?Pageid=4.6 Jerry

Wave soldering after SMD assembling

Electronics Forum | Sun Nov 06 20:52:34 EST 2005 | milroyperera

Hi Ken What exactly the best reffered angle for Sn/Pb & Pb-free soldering? Is there a site where I can read the basic engineering concepts about this topic?

Wave soldering after SMD assembling

Electronics Forum | Mon Nov 07 04:43:02 EST 2005 | lupo

About the anlge typically is 5-7 depending on the machine. If solder smt components, the best is to use (swich on) double wave machine - (swich on both) chip and laminar wave. Regards.

Wave soldering after SMD assembling

Electronics Forum | Wed Nov 16 06:50:59 EST 2005 | milroyperera

Hi, I`m thinking what would be the best way to avoid icicles on lead free solder!

Pb-free wave soldering with SMD

Electronics Forum | Mon Nov 28 21:37:37 EST 2005 | milroyperera

Hi, What would be the standard band width for Pb-free soldering? As per my knowledge this should be 3cm to 6cm. What is best?

SMD acceptable criteria

Electronics Forum | Fri Dec 09 06:25:53 EST 2005 | ajay

thanks for info Most of the defect soldering joint do not take place. Observe that PCB not cleaned properly & also component wetting not good. testing staff expect that all card what ever they receiev shuld be 100% ok. they straight forward complain

Black PAD

Electronics Forum | Tue Jun 13 04:42:26 EDT 2006 | yqdeng@gsl.com.hk

What is "Black pad"in ENIG(Electroless nickel/immersion gold), how to solve if it happen in SMD BGA solder joint?

Black PAD

Electronics Forum | Mon Jun 19 05:00:17 EDT 2006 | YQ Deng

Thanks very much! In fact, "Black PAD" phenomenon have been found in our product, the total BGA came off PCB during drop test. if we apply the underfill to BGA after SMD process, Could the underfill add reliablility of product?

Low tensile strenght of SMD

Electronics Forum | Tue Jul 18 07:50:47 EDT 2006 | adlsmt

Are the leads actually pulling off the pads or are the pads coming up as well? Did you ever try this "experiment" before you used lead-free?


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