Electronics Forum | Tue Nov 22 17:08:03 EST 2011 | mikenagle
I am looking for process suggestions. We want to use a pin transfer system to deposit adhesive to hold bottom side SMD's in place. We will place SMD's and through hole power parts on the top side and then run through a wave solder machine. Are ther
Electronics Forum | Wed Nov 23 07:30:44 EST 2011 | scottp
Are you stuck with pin transfer for some reason? Screen printing is more repeatable and easier to maintain.
Electronics Forum | Wed Nov 23 09:38:52 EST 2011 | blnorman
More agreement with screen print adhesives. Back in a former life time we did do pin transfer on one of our product lines. If you had to go with pins, make sure your adhesive rheology is suited for it. Different adhesives are designed for specific
Electronics Forum | Wed Nov 23 07:38:49 EST 2011 | davef
We agree with the points made by ScottE above. Additionally, most printers are not heavily loaded. So, you wouldn't have to buy another machine, give-up floor space, purchase and store peculiar tooling, etc. We think Darby does pin transfer. Maybe h
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
Electronics Forum | Tue Jul 28 07:02:59 EDT 1998 | smd
Right now we are taping the goldfingers which is effective but also expensive. Also, some tape was leaving yellow marks on the goldfingers. We're trying the so-called goldfinger glove from Steven's Products. It's a very small company (probably one gu
Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
