Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef
Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.
Electronics Forum | Wed Aug 12 15:50:01 EDT 2009 | davef
Wouldn't think of them as peas and carrots. Maybe, tree and carrot. ITAR: Export regulations that are specific. Board fabricators may choose to be ITAR registered. AS9100: Aerospace tailored version of ISO9000. So, it's general. In it's base form, AS
Electronics Forum | Thu Nov 02 04:42:48 EDT 2023 | tinaheussaff
In general, it is safer to use a single alloy with a known composition and performance characteristics. If you need to change the alloy used in your selective soldering machine bath, it is advisable to consult with the manufacturer or a soldering exp
Electronics Forum | Tue Apr 24 11:28:34 EDT 2001 | Barry
Anyone have any specific knowledge of SMTECH 100 i S machines and the pro's and con's. Does the machine capability rank as good bad or indifferent within the industry?
Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi
weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??
Electronics Forum | Tue Sep 23 10:22:40 EDT 2008 | kumaravelu
Is there any specific method or product available to implement FIFO system. Currently we stack all the D/C in a shelf and we don't have a method to pull the latest D/D first. I would appreciate any help in this regard. Sundaram
Electronics Forum | Wed Nov 12 09:39:11 EST 2008 | markhoch
Thanks Dave! I'm fighting the very same battle. Specifications are sparse on the subject, but you offer a very viable solution. (As usual!)
Electronics Forum | Mon Aug 18 22:55:05 EDT 2008 | kpm135
Nozzles are really machine specific. Your best bet, if you're looking for the correct nozzle for a part, would probably be to send a strip of parts and the data sheet to the manufacture of the machine and ask them for their recommendation. Most machi
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
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