Electronics Forum: smpi and specification (Page 1 of 19)

The specification of Paste deposition thickness and volume

Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai

Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,

The specification of Paste deposition thickness and volume

Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef

Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.

ITAR and AS9100...like peas and carrots?

Electronics Forum | Wed Aug 12 15:50:01 EDT 2009 | davef

Wouldn't think of them as peas and carrots. Maybe, tree and carrot. ITAR: Export regulations that are specific. Board fabricators may choose to be ITAR registered. AS9100: Aerospace tailored version of ISO9000. So, it's general. In it's base form, AS

Sn99Cu07 and Sn100

Electronics Forum | Thu Nov 02 04:42:48 EDT 2023 | tinaheussaff

In general, it is safer to use a single alloy with a known composition and performance characteristics. If you need to change the alloy used in your selective soldering machine bath, it is advisable to consult with the manufacturer or a soldering exp

SMTECH pro's and con's

Electronics Forum | Tue Apr 24 11:28:34 EDT 2001 | Barry

Anyone have any specific knowledge of SMTECH 100 i S machines and the pro's and con's. Does the machine capability rank as good bad or indifferent within the industry?

CSP and underfill

Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi

weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??

PCB Storage and FIFO

Electronics Forum | Tue Sep 23 10:22:40 EDT 2008 | kumaravelu

Is there any specific method or product available to implement FIFO system. Currently we stack all the D/C in a shelf and we don't have a method to pull the latest D/D first. I would appreciate any help in this regard. Sundaram

SMT Processing and gasketing

Electronics Forum | Wed Nov 12 09:39:11 EST 2008 | markhoch

Thanks Dave! I'm fighting the very same battle. Specifications are sparse on the subject, but you offer a very viable solution. (As usual!)

Pick and Place Nozzles

Electronics Forum | Mon Aug 18 22:55:05 EDT 2008 | kpm135

Nozzles are really machine specific. Your best bet, if you're looking for the correct nozzle for a part, would probably be to send a strip of parts and the data sheet to the manufacture of the machine and ask them for their recommendation. Most machi

BGA and PCB finishing

Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel

I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false

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