Electronics Forum | Mon Feb 20 20:57:35 EST 2006 | Cal Kolokoy
The ramp sets the stage for flux activation, and if ramping in a linear fashion, burning off some of the volatiles, but yet preserving the activators. The ramp is also intended to preheat the SMDs to prevent thermal shock. Most solder paste data sh
Electronics Forum | Tue Mar 06 15:59:33 EST 2007 | pima
hello I would like to ask you for advise. I have problem with one of my SMT line and skewed parts at the end of line after reflow. My line is composed: DEK, 3d visual inspection of paste printing, IP3, 8 zones reflow oven. I m builidng there produc
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Electronics Forum | Mon May 09 16:44:33 EDT 2011 | dcell_1t
Hi, We have been struggling with an issue of non wetting on a QFP (Renesas - 256, Sn90Pb10) but the issue "desapears" sometimes for a while and then back again suddenly. This is the scenario: Component: QFP 256 / Renesas / Sn90Pb10 / 0.5 mm pitch S
Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t
Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro
