Electronics Forum | Thu Sep 11 16:50:18 EDT 2003 | davef
Sure it's conceivable that thin HASL can cause tombstoning. Harkening back to the ample discussion in the fine SMTnet Archives, tombstoning is caused by an imbalance in solder surface tension between the two pads of SMT component. The source of thi
Electronics Forum | Fri Jun 16 11:43:30 EDT 2006 | dseif
I agree with "Two Cents" that the initial cost is very high, however, we may be able to justify with savings associated with improved layouts (high volume mfg)... so I am also looking into laser depaneling at this time. I have stumbled upon three co
Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl
For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr
Electronics Forum | Tue Jan 03 17:38:38 EST 2012 | davef
Here's two ideas fro the fine SMTnet Archives: * On the bare board, during design / layout, the basic shape of the jumper is a 125 thou disc of copper [that of course is eventually covered with whatever solderability preservative we use on the board]
Electronics Forum | Tue Apr 03 11:08:21 EDT 2001 | vsorin
Hi, Our engineering board has to decide which technology is better for the hand soldering of the SMT components: HASL or Chemical Ni-Au. We have an automatic line for SMD assembling and our experience shows us that for this automatic line is better
Electronics Forum | Tue Jul 16 07:33:32 EDT 2002 | pjc
Communication is the issue. What we have here is a failure to communicate....how does that song go? I implemented a system whereby incoming inspection would check component packaging to the spec. If it did not match they were to contact the process e
Electronics Forum | Fri Sep 06 11:59:20 EDT 2019 | SMTA-Eric
In regards to machine utilization of an automated in-line SMT Placement equipment, is there any statistical data that may indicate what a typical line should expect to achieve? What is a reasonable target for a low volume high mix production environm
Electronics Forum | Thu Apr 13 21:02:37 EDT 2000 | Mario Carluccio
Can anyone advise me what are the types of contaminants which can be present on a printed circuit board at the very beginning of a SMT line. Of these contaminants, are any of them detrimental to the SMT process (i.e. label application, or solder pas
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