Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver
| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i
Electronics Forum | Wed Jun 02 23:53:09 EDT 1999 | Dean
| To you all for comment and summary, | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | 1) A good set of design rules | 2) A good set of design rules meeting pro
Electronics Forum | Fri Mar 07 08:47:45 EST 2003 | msivigny
Hello Peter, In reflow, running a profile and collecting thermal data does not necessarily make it easy to calculate and determine machine capability. On the contrary to your desires of simplifying the process, determining machine capability on an ov
Electronics Forum | Wed Sep 17 11:13:06 EDT 2008 | daxman
You had mentioned that your volumes will be low? How about the mix? will you be changing over to different products a lot? How many different products will you be running? Will feeder setups be done by the operators or will you have a another departm
Electronics Forum | Fri Dec 09 14:02:53 EST 2011 | davef
Have you considered searching on GOOGLE? Here's a link to a used equipment seller that lists Amistar 8mm Feeders that we found on GOOGLE http://www.wotol.com/5-amistar-pf-t84c-8x4-feeder/second-hand-machinery/prod_id/343518/scat_id/1062 Further, us
Electronics Forum | Sun May 30 18:34:04 EDT 1999 | Earl Moon
| | | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accord
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Thu Jun 03 10:09:59 EDT 1999 | Earl Moon
| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann
Electronics Forum | Thu Jun 03 10:53:09 EDT 1999 | Ryan Jennens
| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca
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