Electronics Forum | Wed Dec 15 12:41:49 EST 2004 | DasonC
Check IPC-A-610C Chapter 12.1, Staking Adhesive
Electronics Forum | Wed Dec 15 04:31:26 EST 2004 | huangfox
yes,it maybe lead to test failure,because solder joint is bad
Electronics Forum | Wed Dec 15 09:00:07 EST 2004 | russ
All of the SMT adhesives that I have used are non-conductive by themselves. I assume that the solder joints are formed by wave soldering?
Electronics Forum | Tue Dec 14 13:26:19 EST 2004 | Peter
I have a question regarding post cured property of SMT adhesive. If after component placement, the epoxy dot gets compressed and bridges between the 2 pads, what would the impact on the circuitry? Would it pose risk for flux entrapment? Could the cu
Electronics Forum | Wed Oct 14 10:04:02 EDT 1998 | Dr. Kantesh Doss, Siemens Energy & Automation, Inc.
Sanjay: Keys to successful adhesive printing are: 1. Understanding the flow behavior of the adhesive under constant shear stress 2. Stencil design, i.e. stencil aperture opening 3. PWB Footprint 4. Stencil printing parameters Optimizing all these fac
Electronics Forum | Wed Oct 14 13:52:59 EDT 1998 | Bill Schreiber
Dear Sanjay, An important issue involved when stencil printing adhesives vs. solder paste is: How do you clean the stencils after printing? Do you need two machines? Two chemistries? Two waste streams? What are the potential environmental impacts an
Electronics Forum | Mon Oct 30 04:32:23 EST 2000 | honda
we want to study printing adhesive,does anyone have advice on process parameter setting of adhesive printing? best regards!
Electronics Forum | Thu Feb 13 11:00:07 EST 2003 | cbarnett
Looking for feedback from anyone that is currently screen printing adhesive and having good results. If results are good, what type adhesive and type machine is being used?
Electronics Forum | Tue Oct 13 18:03:40 EDT 1998 | Sanjay Bhatikar
Sirs, What are the issues involved when a stencil printer is used for printing solder paste and adhesive? UV-curing of adhesive appears to help reduce slump and spread by forming a tough skin on the adhesive blob deposited on the PCB. Is th
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