Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Wed Sep 14 04:09:21 EDT 2016 | jimmyh
We are enclosing our SMT room and will control the Humidity and Temperature of the room. Is there a standard for humidity and temperature for a SMT room and if so what is it. What is protocol if it goes out of tolerance? Do we stop production? Is
Electronics Forum | Wed Mar 05 12:23:31 EST 2003 | msivigny
Hello Phil, We did use an Oracle relational database with an Access front end to input and query data from the system for reports. We did not perform SPC with the Oracle dB. As the whole data collection process was completely customized, we hadn't im
Electronics Forum | Wed Aug 12 23:03:05 EDT 2009 | davef
Here's a boiler plate ITAR control plan http://www.cfisac.org/Resource/tcp.doc
Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj
The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i
Electronics Forum | Wed Feb 09 21:19:03 EST 2005 | Mrduckmann2000
Russ, We can not use a wave pallet, already went that route. We have parts next to the thru-hole pins and between thru-hole pins. I am going to try an experiment in the next day or so with solder mask. I plan to solder SMT parts on the back of se
Electronics Forum | Sat Jan 25 17:46:07 EST 2003 | testing
I am currently finding it challenging(help!) to determine how I can introduce SPC ontrol within the AOI process and how the AOI can help control other SMT processes. Can someone please provide me with some ideas or any of excels fancy charts/macro
Electronics Forum | Wed May 31 21:33:52 EDT 2006 | jacksaria
Hello jbrower, Thank you for the feedback. Actually, our main problems is the pick and throw. Whats your suggestion how to control the pick and throw?What are the factors that affecting pick and throw?How to reduce the sources of variance at each st
Electronics Forum | Wed Oct 07 11:51:51 EDT 1998 | Clifford Peaslee
You may have noticed that we have started using cookies on the site, and I wanted to explain the importance of cookies. Cookies are used at SMTnet to facilitate future enhancements of the site like personalizing your experience while browsing our si
Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno
Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr
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