Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef
Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat
We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be
Electronics Forum | Mon Dec 22 20:16:17 EST 2008 | davef
The first question in solving the "ol' SMT component loss after second-side wave operation" problem is: So, what makes you think the components actually came-off in the wave and not during some previous 'handling'? Putting that aside, we'll play thi
Electronics Forum | Fri Jan 28 12:45:14 EST 2005 | Indy
That is what we call as good "Problem Solving Skills". :)
Electronics Forum | Fri Jan 28 01:56:32 EST 2005 | Chua
Hi, I could like to find out what are the things need to look out if I'm doing a new SMT solder paste ( water soluble & no-clean ) evaluation. And also flux ( spray type ) for wave-solder ( water soluble & no-clean ). Appreciate for all the input..
Electronics Forum | Sat Jan 29 05:43:51 EST 2005 | Chua
Hi Chunks, Thanks for your input. Appreciate you could send me a copy of your evaluation list as this type of evaluation is new to me..... Here is my email address :- pgchua@cyberway.com.sg Thanks.
Electronics Forum | Tue Feb 01 20:08:39 EST 2005 | davef
Look here: http://www.epa.gov/ozone/snap/icel/noclean2.pdf
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