Electronics Forum | Thu Nov 13 22:20:48 EST 2008 | davef
For your pad layout and spacing between components, look here: http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=77b562c1-b8f8-db11-8a6a-005056875b22 For your standoff height in SMT, we do not concern ourselves with standoff height. It
Electronics Forum | Wed Nov 12 04:34:17 EST 2008 | kywl
Hi all, Assuming that i were to design a PCB and there are multiple components, what is the minimum spacing required to ensure that i won't have problems in my SMT process later on? Also, is there a minimum component stand-off height spec as well?
Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ
What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 220.127.116.11 it provide the guidelines for SMT standoff heig
Electronics Forum | Fri Nov 14 07:32:24 EST 2008 | davef
Yes, courtyard gives you the space requirement of a component. Sometimes, the working space of a rework tool takes precidence, though.
Electronics Forum | Thu Aug 11 16:38:36 EDT 2005 | russ
Don't have a picture but a ribbon lead is jaust a flat lead with no standoff capability. look at a SMT electrolytic cap for this lead type.
Electronics Forum | Tue Jul 06 12:06:32 EDT 2010 | baildl632
Is the board a two sided smt board? If so, where are the standoffs (board supports) located during the second side run? The 0805 being thicker than the 0603 may explain why 0805 was cracked less.
Electronics Forum | Thu Jul 03 15:03:39 EDT 2003 | Jim Nunns
My design group wants to change our route keep out around all SMT parts to 5 mil even under the parts with zero standoff. Are others in the industry routing under parts that have no standoff? My fear is that we will get shorting if the mask is scaped
Electronics Forum | Thu Sep 22 14:25:13 EDT 2011 | hegemon
Dave has stated the caveats well. I too have similar experience in reworking BGAs that mirrors your own. The only situation where I saw this as an issue, was in memory devices where a row of BGAs might share a commonm heatsink. In those cases the
Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef
There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height
Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl
For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr
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