Electronics Forum: sn wick off (Page 1 of 23)

Solder wick on Ag/Pd termination

Electronics Forum | Mon Oct 22 20:41:32 EDT 2007 | jkhiew

Hi Dave, The solder has tended to wet the component termination of Ag/Pd (chip capacitor) but has not wetted the pads, whereas the solder has wetted both termination & pads when using Ag/Ni/Sn finishes. Thks

Solder wick on Ag/Pd termination

Electronics Forum | Mon Oct 22 05:04:08 EDT 2007 | jkhiew

Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We

BGA Detached off the board

Electronics Forum | Mon Aug 11 11:00:40 EDT 2008 | eyalg

RoHS BGA. No lead in it. > RoHS BGA. No lead in it. ok. this is not the case .It was sn/pb type...

PAD come off from PCB after Rework

Electronics Forum | Wed Apr 19 09:07:44 EDT 2006 | russ

Many times a pad that has no signal trace going to it will come off. It does happen from heat and time as noted before. Somtimes even the best rework person will remove them. If this can not happen in your situation I would recommend that you use

BGA dropping off underside of board

Electronics Forum | Mon Aug 13 11:05:18 EDT 2007 | saaitk

Would I be correct in assuming that the solder used to attach the BGA ball to the device body should have a higher liquidous point that the solder used to attach the device to the board. If the peak reflow temp for SnPb is around 225 deg should the b

BGA dropping off underside of board

Electronics Forum | Mon Aug 13 22:39:36 EDT 2007 | davef

The solder used to attach the BGA ball to the BGA interposer would have a liquidous point dependent on the type of solder used by the device fabricator. If this is a lead free device [altho we don't think so], the solder used by the fabricator would

BGA dropping off underside of board

Electronics Forum | Mon Aug 13 05:39:31 EDT 2007 | saaitk

I am building a double sided SMT board. On the first side I have a 405 ball BGA. When we build and run the second side through our reflow oven on about 25% of the boards run the 405 ball BGA on the underside of the board has fallen off. About 80% of

SN100C wetting problems

Electronics Forum | Thu Jul 19 17:22:17 EDT 2007 | gregoryyork

You need to dwell the boards longer in the wave as the board is the largest heatsink. Just make sure the flux can take the longer dwell times anything up to 4 - 5 seconds so you may have to shallow your angle as well to around 5 - 6 degrees this will

No-Lead solder defect - No solder on pads

Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel

I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa

Yellowish

Electronics Forum | Tue Oct 03 17:04:07 EDT 2006 | cuculi54986@yahoo.com

Glenn, What alloy are you using for Pb-free HASL? You say tin copper nickel, but is it SN100C? Against manufacturing engineering's recommendation, my company specified simply "Pb-free HASL" as the finish for our Pb-free PCBs. One of our suppliers

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