Electronics Forum | Mon Nov 19 10:06:15 EST 2001 | davef
Git otta taun!!! I never have heard of an Sn62 BGA solder ball. Several thoughts on Sn62: * Look at http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4603&#Message17953& * Search the fine SMTnet Archives on � Sn62 �
Electronics Forum | Thu Jan 15 09:04:36 EST 2004 | rkevin
Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?
Electronics Forum | Fri Jan 16 07:00:32 EST 2004 | mk
ssd eliminates voids from BGA's. Check out http://www.sipad.com
Electronics Forum | Thu Dec 02 07:40:54 EST 2010 | scottp
2000 cycles of -40/+150C thermal cycling.
Electronics Forum | Thu Jan 13 11:52:17 EST 2000 | Christopher Lampron
Jim, Yes this does keep on coming up in the forum as JAX states. There is a pluther of information in the archives. I have had some problems with 0603's in the past. If it is possible, try using a 2% silver SN62 solder paste. This helped me in many s
Electronics Forum | Mon Oct 18 11:01:26 EDT 2004 | DenisM
I have had similar problems and my customers have had this too. A two story drop test was made by one of my customers and they found that changing Sn63 solder to Sn62 solder made a significant impact. There is no real downside other than a slightly
Electronics Forum | Tue Apr 26 11:22:48 EDT 2005 | denismeloche
I have found that Sn62 solder gives better strength and leach resistance when soldering to gold surfaces. The gold needs to be at least 5 to 10 micro inches thick to prevent nickel oxidation but if over 25 micro inches will cause brittleness. I hav
Electronics Forum | Tue Dec 13 21:25:33 EST 2005 | Slaine
the part is a pi filter device, originally the supplier was nanufacturing it with HMP by dipping it, the giving it a Sn62 over dip to maintain solderability, to supply a RoHS compliant product they just left off the Sn62. so yes on compliant part the
Electronics Forum | Tue Nov 30 17:47:25 EST 2010 | ck_the_flip
1.) Are there any industry white papers written that document any advantages in running this alloy? From what I've read, this alloy was formulated to prevent leaching of silver for silver-bearing component terminations. 2.) Are there any concerns w
Electronics Forum | Thu Apr 15 09:45:34 EDT 1999 | Terry Keen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
