Electronics Forum: snpb and contaminated (Page 1 of 16)

lead free platings and tin lead

Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef

NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa

RNETs and Lead Free

Electronics Forum | Wed May 07 10:15:46 EDT 2008 | llaerum

We are also having some issues with certain small parts. In our case this is tantalum caps and 0402 caps. We had a vendor admit after much discussion that the plating used from a particular orgin was different on the tantalums. The tehory is thatthsi

solderability and hasl thickness

Electronics Forum | Fri Sep 12 13:14:33 EDT 2003 | Mark Kostinovsky

A little adition to Norm's statement: Sn-Pb intermettalic compounds do not accept solder as they are (even without being oxidized).

Aluminum and silica contamination

Electronics Forum | Wed Jan 12 13:42:19 EST 2011 | dwonch

Hi All, I'm hoping there is a PCB expert or two hanging around. We're having some solderability issue on our boards. The finish is ENIG but it doesn't seem to be related to the finish process itself. We did SEM and EDX analysis and found aluminum an

N2 and Voiding??

Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp

Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman

Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.

Imm Silver and Voiding

Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman

Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?

Re: Wash and bake of blank PCB's before assembly

Electronics Forum | Thu Feb 12 17:21:07 EST 1998 | Justin Medernach

| I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards | before assembly. | + Is it necessary to wash and bake PCB�s before assembly? | + If any, what is the reason for wash and bake of PCB�s? | + If any, wh

Re: Voids and BGA

Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon

| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I

Stencil cleanliness and inspection

Electronics Forum | Thu Jun 07 13:40:12 EDT 2001 | kerryn

Dave, We have very short runs (less than one hour). We have stencils all over the place waiting to be cleaned. It is too time consuming to scope each stencil to inspect for cleanliness. Do you know of any automated or scanning devices that can ra

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