Electronics Forum | Tue May 27 11:59:14 EDT 2003 | blnorman
Is anyone aware of any reports, studies, articles on the subject of silicon contamination in SnPb solder joints. We are evaluating repair of conformally coated (silicone) boards. The fear is that we will never totally remove the silicone and once i
Electronics Forum | Thu Jul 31 23:07:55 EDT 2008 | davef
J-STD-006 lists maximum contamination levels for most solder alloys. This is the basis for purchasing solder. The SOLDER BATH contamination levels in J-STD-001 are based on decades of experience. But these contamination thresholds of various metals
Electronics Forum | Tue Nov 07 10:43:25 EST 2006 | muse95
Also, have you considered the possibility that if you solder on an existing joint on a board that was built with SnPb solder, even though you are using leadfree solder wire, you would now contaminate the tip of your soldering iron. If you then start
Electronics Forum | Mon Feb 18 15:20:38 EST 2008 | davef
SN100C contains no phosphorus. It has a dross rate equal or lower than tin-lead solder, where as SAC drosses at 2 to 3 times the dross rate of tin-lead solder. Addition of solder dross inhibitors, such as phosphorus, can be effective inhibitors of
Electronics Forum | Fri Nov 11 20:41:58 EST 2005 | GS
Thank you Davef, If I am not wrong in understanding, your answer is mainly related to the Legal point of view according to several different Countries who adopted Rohs or equivalent. My question, sorry for my poor English, is mainly related to the
Electronics Forum | Tue Jun 20 10:15:44 EDT 2006 | samir
Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro
Electronics Forum | Thu Aug 23 09:52:38 EDT 2007 | d0min0
Hi, in past we had an issue with ENIG surface, black was Ni that get pass the Au - but it was discovered after reflow (SnPb) and the IC was losing contact with Cu tracks...at customers application :| Reason was as I remember too thin Au sufrace... w
Electronics Forum | Thu Jun 28 09:38:14 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Thu Jun 28 09:38:20 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Mon Sep 11 09:43:14 EDT 2006 | C.K.
So, your scenario is: * Lead Free Solder Paste * Lead Free Reflow Profile * RoHS Components * Non-RoHS (Sn-Pb HASL plated)PCB If that's the case, you should be just fine running your Lead-Free process. There is literature on the topic of lead
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