Electronics Forum | Fri Mar 06 10:46:35 EST 2009 | davef
First, we agree with Loco that your QFP is nonwetting, rather than dewetting. Your sceen-shots look like ol' timey SnPb paste recipes. Turn-up the heaterometer dial. Second, on nitrogen: * We kinda think your O2 needs to be around 100ppm with 99.99%
Electronics Forum | Thu Apr 20 02:27:11 EDT 2017 | pavel_murtishev
Mile, Please tell me more about your soldering process: - Are soldering process parameters the same for all three pins? - Is unsoldered pin connected to thermal heavy copper polygon? - What is your board surface finish? HASL? - Sn/Pb or LF process?
Electronics Forum | Fri Jul 09 10:32:47 EDT 2010 | rafacadiz
Hi Sean, I have seen this issue with lead free component on Sn-Pb solder process, I don´t know if it´s your case. Some times, pins not reach the necessary T for solder due to lead free metalization and in other case due to a groud pad, with a big T d
Electronics Forum | Mon Oct 22 17:37:51 EDT 2001 | davef
I�m aware of no such standard. There may be something in Euroland [ie, IEC, etc.] TM-650 �Test Methods Manual� has procedures for measuring various types of contamination, such as: * 2.2.25 �Detection Of Ionizable Surface Contaminants� * 2.2.27 �Cl
Electronics Forum | Mon Jun 14 10:23:53 EDT 2010 | pcrane
I have CCA that has a SN100C HASL coating that I am wave soldering with SbPb. I have mounting pad areas on the CCA that are masked with a pallet during reflow so they are not exposed to the solder. The mounting pads are turning gray in some areas of
Electronics Forum | Wed May 14 12:42:16 EDT 2008 | rgduval
Dave, Realized I didn't respond to one of your questions. We pasted and reflowed one board, with no components. This board exhibited extreme dewetting on all pads. The board was LF-HASL, and the paste was Qualitek (which we've used for approximat
Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
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