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soak

http://www.hellerindustries.com/search.php?zoom_query=soak

soak Reflow Soldering Dual Lane / Dual Temperature Curing & Back-end Semiconductor Voidless / Vacuum Fluxless / Formic Acid Soldering Pressure Curing Ovens (PCO & New Zealand Europe Contact » Search Heller Industries » soak soak Match: any search words all search words Search results for: soak 4 results found . CONFIDENTIAL Heller Industries Fluxless Reflow Advantages 1. Can use any reflow profile (e.g., tent or soak profile) with formic acid 2. Can adjust formic acid profile in oven in conjunction with thermal reflow profile 3 operating temperature of 450 C helps maintain the very low T required for lead-free reflow. Because Sony's lead- free profile requires a rapid ramp-up from the 160-180 C plateau to the 235 C plateau, it became necessary for boards to move from a 180 C soak zone to a 290 C ramp-up zone operating temperature of 450 C helps maintain the very low T required for lead-free reflow. Because Sony's lead- free profile requires a rapid ramp-up from the 160-180 C plateau to the 235 C plateau, it became necessary for boards to move from a 180 C soak zone to a 290 C ramp-up zone

http://www.hellerindustries.com/Inline-Vacuum-Reflow-System.pdf

elimination Ultrasonics Station in Convection Oven Ultrasonics Station Ultrasonics Test Reflow Profile Sample # vibration duration (s) Soak time (s) (160Soak time (s) (160217 C Maximum temperature ( °c) Total time (s) 1 0 50 60 239 208 123 Total void% =14.03 Largest void% =2.08 Total void% =13.16 Largest void% =2.82 Total void% =25.18 Largest void% =4.14 Void Results – Ultrasonics ON for 10 sec Sample # vibration duration (s) Soak time (s) (160217 C Maximum temperature ( °c) Total time

Surface Insulation Resistance (SIR) Testing

http://www.soldertools.net/product_images/stencilquik/papers/SIRTestResults_Best%20Inc_Flux.pdf

) NEBS standard GR-78, Issue 1, Section 13.1.3 was performed. Initial room ambient measurements were made and was followed by a 24 hour unbiased soak at 35 deg. C and 85 % RH . Another set of measurements was done at this time. This was finally followed by a 96 hour soak at 35 deg. C / 85 % RH with a 50 Vdc bias between the patterns and common . Final measurements were made while under soak and bias removed. Wired test board Results An average of the 8 measurements for each board was computed . Initial Measurements With Stencil 1.0 x 10^12 ohms Without Stencil 2.9 x 10^10 ohms After Soak With Stencil 9.3 x 10^9 ohms Without Stencil 7.7 x 10 ^8 ohms After Soak and Bias With Stencil 1.1 x 10^10 ohms Without Stencil 2.8 x 10^9 ohms In each case the Insulation Resistance is higher for the samples using the stencil

Surface Insulation Resistance (SIR) Testing

http://www.soldertools.net/product_images/stencilquik/papers/SIRTestResults_Best%20Inc_Paste.pdf

. Surface Insulation resistance measurements as documented in the Telecordia (Bellcore) NEBS standard GR-78, Issue 1, Section 13.1.3 were perfromed. Initial room ambient measurements were made and was followed by a 24 hour unbiased soak at 35 deg . C and 85 % RH. Another set of measurements was done at this time. This was finally followed by a 96 hour soak at 35 deg. C / 85 % RH with a 50 Vdc bias between the patterns and common . Final measurements were made while under soak and bias removed. Wired test board AG Communications SIR Study StencilQuik™ Paste Only Page 2 Document AGC 05042004RevB AG Communications SIR Study StencilQuik . h Initial Measurements With Stencil 2.0 x 10^10 ohms Without Stencil 8.5 x 10^10 ohms After Soak With Stencil 2.1 x 10^9 ohms Without Stencil 4.0 x 10 ^9 ohms After Soak and Bias With Stencil 2.6 x 10^9 ohms Without Stencil 5.4 x 10^9 ohms The Insulation Resistance is marginally lower for the samples using Stencil Quick

Microsoft Word - Bi58_888D_TDS_b.doc

http://qualitek.com/wp-content/uploads/2017/06/Bi58_888D_TDS_a.pdf

.) determine the actual reflow profile. 0 20 40 60 80 100 120 140 160 180 200 0 30 60 90 120 150 180 210 240 270 300 330 360 Time (Sec) T e m p ( C ) Peak Temp Min 155 °C Max 175 °C Reflow Time= 60-80 Sec 139E Soak Soak temp 80-110 °C 30-120 s 1.5-2.0 min <2.5 C/sec Preheat Preheat Zone- The preheat zone, is also referred to as the ramp zone, and is used to elevate the temperature of the PCB to the desired soak temperature % of the total heated tunnel length. The Soak Zone- normally occupies 33-50% of the total heated tunnel length exposes the PCB to a relatively steady temperature that will allow the components of different mass to be uniform in temperature . The soak zone also allows the flux to concentrate and the volatiles to escape from the paste. The Reflow Zone- or spike zone is to elevate the temperature of the PCB assembly from the activation temperature to the recommended peak temperature

Microsoft Word - Bi58_888D_TDS_b.doc

https://qualitek.com/Bi58_888D_TDS_a.pdf

.) determine the actual reflow profile. 0 20 40 60 80 100 120 140 160 180 200 0 30 60 90 120 150 180 210 240 270 300 330 360 Time (Sec) T e m p ( C ) Peak Temp Min 155 °C Max 175 °C Reflow Time= 60-80 Sec 139E Soak Soak temp 80-110 °C 30-120 s 1.5-2.0 min <2.5 C/sec Preheat Preheat Zone- The preheat zone, is also referred to as the ramp zone, and is used to elevate the temperature of the PCB to the desired soak temperature % of the total heated tunnel length. The Soak Zone- normally occupies 33-50% of the total heated tunnel length exposes the PCB to a relatively steady temperature that will allow the components of different mass to be uniform in temperature . The soak zone also allows the flux to concentrate and the volatiles to escape from the paste. The Reflow Zone- or spike zone is to elevate the temperature of the PCB assembly from the activation temperature to the recommended peak temperature

http://www.hellerindustries.com.cn/Inline-Vacuum-Reflow-System.pdf

elimination Ultrasonics Station in Convection Oven Ultrasonics Station Ultrasonics Test Reflow Profile Sample # vibration duration (s) Soak time (s) (160Soak time (s) (160217 C Maximum temperature ( °c) Total time (s) 1 0 50 60 239 208 123 Total void% =14.03 Largest void% =2.08 Total void% =13.16 Largest void% =2.82 Total void% =25.18 Largest void% =4.14 Void Results – Ultrasonics ON for 10 sec Sample # vibration duration (s) Soak time (s) (160217 C Maximum temperature ( °c) Total time

2015 Micron KEG Supplier Summit

http://www.hellerindustries.com.cn/pdfs/fluxless-reflow.pdf

. Can use any reflow profile (e.g., tent or soak profile) with formic acid 2. Can adjust formic acid profile in oven in conjunction with thermal reflow profile 3

http://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/productinfo-pressure-sprayer-en.PDF

 Allow cleaning agent to soak for 3-5 minutes  Wipe the surface clean with a cloth  Release the pressure after each use by turning the safety valve

https://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/productinfo-pressure-sprayer-en.PDF

 Allow cleaning agent to soak for 3-5 minutes  Wipe the surface clean with a cloth  Release the pressure after each use by turning the safety valve

Upgrades | Intellimax | WINCON | BTU International

http://www.btu.com/customer-support/upgrades/intellimax-wincon/

. Many new features are included in the latest release of WINCON are: Heat Up Soak Timer, Process Pause, On the fly Oiler, and GEM Host enhancements . Compatible with all Intellimax Controllers including the new INTELLIMAX2 The new Heat Up Soak Timer feature allows  equipment soak for a small amount of time to help stabilize before running product. Programmable Oiler

WINCON™ Control System Reflow Oven Controller | BTU

https://www.btu.com/products/wincon-control-system/

. Heat Up Soak Timer feature allows for equipment soak for a small amount of time to help stabilize before running product. Open Loop Pressure Control

Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

http://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

. They are normally dependent on the materials being used (solder paste or flux) and would typically be as follows. Zone Time Duration (s) Target Temperature C Pre heat 60 to 90 sec 100 to 120 Soak 60 to 90 sec 155 to 175 Soak 2 60 to 90 sec 210-220 Reflow 30 to 60 sec 230 to 240 On any reflow soldering system that heats both sides the thermocouple trace appears to be normal – hitting the desired pre-heat, soak and reflow temperatures. In this case with either solder paste or flux, a very low pass rate was achieved

Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

. They are normally dependent on the materials being used (solder paste or flux) and would typically be as follows. Zone Time Duration (s) Target Temperature C Pre heat 60 to 90 sec 100 to 120 Soak 60 to 90 sec 155 to 175 Soak 2 60 to 90 sec 210-220 Reflow 30 to 60 sec 230 to 240 On any reflow soldering system that heats both sides the thermocouple trace appears to be normal – hitting the desired pre-heat, soak and reflow temperatures. In this case with either solder paste or flux, a very low pass rate was achieved

KYZEN CP90D | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions

https://www.kyzen.com/products/kyzen-cp90d/

.     Applied as Received via Dip, Soak, Brush or Coarse Spray Methods Easy to Use Designed to protect parts in indoor and covered storage and shipment Cures to an amber colored transparent film

Optisolv OP7440 | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions

https://www.kyzen.com/products/optisolv-op7440/

. OP7740 is safe on polycarbonate and optical monomers as well as environmentally friendly. OP7440 is successfully used in immersion agitation, ultrasonic, soak, dip or hand applications

Microsoft Word - Sawa Ultrasonic Stencil Cleaners.doc

http://seikausa.com/sites/default/files/product/sawa/sawa-cleaner-innovation.pdf

. Other washers try to make up for this deficit by heating the solvent or increasing the soak time of the stencil. This can lead to delamination of the mesh from the stencil as well as increase tact time

00600-656

http://seikausa.com/sites/default/files/product/mcdry/mcdry-smt-magazine.pdf

. The eight moisture classification levels and floor life are listed below. For details regarding soak time criteria, reference J-STD-020

Branson Thermal X Heat Staker - In Stock & Ready… | LEL International

https://www.wearelel.com/semi/buy/plastics-cnc/branson-thermal-x-heat-staker

& Soak, Post Cooling & Shuttle Control Contactless Opti-Touch with Two Hand Anti-Tie-Down 23.5" Maximum Working Height Without Upper

SMT Assembly "Boot Camp" Course | Electronics Assembly Training - Solder.net

https://www.solder.net/training-courses/smt-assembly-class/

and the best resolution Straight ramp vs. ramp/soak/spike Impact of cooling cycle Effect of N2 Defects caused by improper profile Wave Soldering Analysis of the wave solder and selective solder process including profile generation, flux

KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow

http://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html

. Extensive testing revealed substantial benefits in setting up profiles in 1°C increments. Slight setpoint changes in the soak and reflow zones produced more robust profiles that reduced temperatures at hot spots on the board and provided more even heating across the assembly

KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow

https://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html

. Extensive testing revealed substantial benefits in setting up profiles in 1°C increments. Slight setpoint changes in the soak and reflow zones produced more robust profiles that reduced temperatures at hot spots on the board and provided more even heating across the assembly

How to make a good PCB solder ball

https://www.ourpcb.com/solder-ball.html

. Moisture seeps into the solder paste during refrigeration. If the paste does not attain room temperature after you remove it from the refrigerator, it will soak up the moisture

Porosity of Gold Plating

http://ipc.org/TM/2.3.24.pdf

. 5.2 Gold on Copper Test Method 5.2.1 Soak the Whatman 542 filter paper for 10 minutes in a fresh 10% solution of cadmium chloride in distilled water con- taining 0.1 ). 5.2.4 Soak the photographic blotting paper in distilled water and dry to a degree of dryness that produces consistent, sharply defined electrograms . 5.3 Gold on Nickel Method 5.3.1 Soak the Whatman 542 filter paper for 10 minutes in a 0.8% solution of nioxime (cyclohexane 1:2 dione dioxime) and distilled water

Plating Quality Hull Cell Method

http://ipc.org/TM/2.3.21.pdf

. 5.1.7 Soak in mild soak cleaner. 5.1.8 Reserve current clean at 2 amps for one minute. 5.1.9 Cold water rinse. 5.1.10 Acid dip 10% C.P. Hydrochloric Acid for 5 seconds

GS329-2008-06-02.fm

http://islandsmt.com/wp-content/uploads/2017/05/MyReflow-Series-specification.pdf

. allowed temp difference between last soak zone and first peak zone 80°C Standard Enhanced zone definition between last soak and first peak 120°C Optional Max . allowed temp difference between two adjacent soak zones 50°C HEATERS myReflow.com 1 7 SPECIFICATION GS329 1.5 COOLING MODULES ➊ = Max 3 controls (in case of more cooling zones controls will be in serial

Clean Coat Workcell Operator's Card

http://www.nordson.com/en-us/divisions/asymtek/documents/Manuals/303812a.pdf

. Switch off the heater. 2. Soak the film coater extension in solvent. 3. Keep the fluid circulating for 15 minutes. 4. Switch off the system by pressing the EMERGENCY STOP button or by turning the ON/OFF switch to OFF of eye irritation. Wear safety goggles. 3. Follow these steps if the nozzle is clogged: a. Unscrew the nozzle using a 1/4-in. wrench. b. Soak the nozzle in solvent. c. Examine the nozzle orifice with a magnifying glass. Use a broach to remove any remaining

Century C-708 and C-718 Workcell Operator's Card

http://www.nordson.com/en-us/divisions/asymtek/documents/Manuals/303847a.pdf

. Turn off the heater 2. Soak the film coater extension in solvent. 3. Keep the fluid circulating for 15 minutes. 4. Switch off the system by pressing the emergency stop switch or by turning off the ON/OFF switch these steps if the nozzle is clogged: a. Unscrew the nozzle using a 1/4-in. wrench. b. Soak the nozzle in solvent. c. Examine the nozzle orifice with a magnifying glass. Use a broach to remove any remaining material in the nozzle orifice. Carefully insert

https://smta.org/smtai/SMTAI2017-Brochure.pdf

requirements >> Features of a reow equipment >> Reow zones and prole parameters >> Comparison between the Sn-Pb and Pb-free reow process >> Types of reow prole a. Ramp-Soak-Spike b. Ramp-to-spike or Straight c. Shoulder d. Flat Head >> Reow prole band and its

Workshops | SMTA International

https://smta.org/smtai/workshops.cfm

      a. Ramp-Soak-Spike       b. Ramp-to-spike or Straight       c. Shoulder       d. Flat Head 13. Reflow profile band and its use 14. Procedure to generate reflow profile 15. Oven setting parameters 16. Procedure of thermocouple attachment 17. Issues affecting

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