Electronics Forum: soak (Page 11 of 55)

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Sat Jun 01 04:27:37 EDT 2019 | gregoryyork

Increase paste volume and use ramp soak spike profiling. Reducing volume of paste often leads to entrapment. Good idea to know difference between voiding and dewetting due to contamination

Reflow Profiling

Electronics Forum | Tue Jul 30 10:44:20 EDT 2019 | vchauhan

Can anyone please share a document which details about the soldering defects if you have less or the excessive preheat time, soak time, peak temperature, time above liquidous (TAL)and cooling time. Appreciate your help in advance.

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Fri Mar 27 03:42:17 EDT 2020 | sssamw

Did you try 0.12 or 0.1mm nano coated stencil @ 10 mil aperture? A soak time type profile with long reflow time could help.

Solder on gold finger

Electronics Forum | Sun Jul 26 20:54:40 EDT 1998 | Masdi Muhammad

Hi, Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subjecte

Re: The care and feeding of adhesive nozzles

Electronics Forum | Mon May 24 13:06:12 EDT 1999 | Deon Nungaray

Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcohol, blowing them o

Re: reflow profile

Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee

The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell

Re: Lo Behold Voids!!!!

Electronics Forum | Fri May 21 14:22:56 EDT 1999 | Dave F

Dave, i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered

Solder particals in the oven?

Electronics Forum | Thu Jun 06 11:42:24 EDT 2002 | Brad Jakeway

What you are seeing on your gold fingers is referred to as flux spattering. This is a very commond problem with gold fingers if you have a zero flux spattering criteria for quality control. The key to eliminating this problem is in the reflow profi

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 02 09:29:08 EDT 2002 | dason_c

Ian, First, I baked the parts at 125C for 48 hours and check the weight Second, I soaked the parts above 30C and 60% for 96 hours and check the weight Calculate the weight gain, suppose only moisture add to the parts during soaking, say a Third, dry

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe

Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s

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