Electronics Forum: soak (Page 6 of 55)

Re: Surface Mount Solder Balling

Electronics Forum | Wed Jun 03 08:46:32 EDT 1998 | Ryan Jennens

Thanks everybody for the help! We are still working on the bottom side, but the top side solder balling seems to have gone away for now. We flattened out the middle soak zone of the profile, so that rather than an even ramp up, the board heats quick

Solder on gold fingers

Electronics Forum | Thu Oct 28 17:46:44 EDT 1999 | Gary Kemp

My company manufactures memory modules and I'm finding solder specs on the gold fingers following the reflow process. We are using a no-clean solder paste. The spec sheet warns against crossing the 140 degree C mark during the soak stage, preventin

Re: NC Flux Splattering

Electronics Forum | Wed Aug 23 15:19:11 EDT 2000 | Dr. Ning-Cheng Lee

From solder material point of view, a solder paste with slow coalescence rate, or slow wetting rate, will be most desirable. Processwise, allowing the paste to stay at soaking zone for longer time will dry out the volatiles, and reduce the chance of

Re: Lo Behold Voids!!!!

Electronics Forum | Fri May 21 10:16:31 EDT 1999 | Parvez

Dave, i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered to b

Reflow Temperatures and speed for a 7 zone top/bot for conceptro

Electronics Forum | Wed Jun 25 12:20:03 EDT 2003 | russ

This may make it easy, Do you really need soak? Or can you just ramp to reflow. Most pastes that I am aware of perform just as well using the linear ramp as opposed to the ramp/soak /spike. Now, out of curiosity how are you attaching the thermocou

Lead Free Delta T (reflow 7 zones)

Electronics Forum | Thu Mar 09 16:14:19 EST 2006 | marc

CGO Assuming your system is performing well here are a few ideas to help out your profile.... - Pull the material spec and ensure you are meeting the requirements for times and temp. Many times the material will allow a mild soak of the board prior

Film Chip Capacitor reflow problems

Electronics Forum | Fri Sep 08 11:29:40 EDT 2006 | GPP

James, What type of profile are you using. Ramp-to-Spike, Ramp-Short Soak-Spike, or Long-Low Spike? I had a similar problem in a past life - random skews on chip components - and got rid of it by converting to Ramp-to-Spike (the old profile was R

Lead-free profile for big electrolytic cap

Electronics Forum | Tue Sep 11 04:45:25 EDT 2007 | pavel_murtishev

Good afternoon, Oops. Quite huge difference I must say. But you should try to tweak your profile anyway. First of all try to enlarge soak time as Mr. RDR has said. What process type do you use? Lead or lead-free? By the way, there are lead-free proc

Solder Voids

Electronics Forum | Mon Aug 18 17:15:15 EDT 2008 | jlawson

This can be seen on leaded soldering also as well as LF (worse with LF). To reduce this you can look at your stencil and profile. Printing a cross-hatch deposit can reduce the voiding as it allow gasses to release when in reflow - thats the theory

Finding a white strand on fine pitch components

Electronics Forum | Fri Aug 28 05:07:59 EDT 2009 | sachu_70

Do you clean the stencil manually or using the automated under-stencil cleaner on your Printer (recommended)? 1. Ensure that stencil wipes are lint-free and soaked sufficiently with solvent before use. 2. If your printer supports automated cleaning


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