Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F
Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:
Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Mon Oct 23 07:10:14 EDT 2017 | emeto
For packages, you use packages names.There is only one SOIC8. The other 8-lead devices are there and it is your job to learn their names. For components descision should be made based you your whole(part number)system.
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Mon Oct 23 02:37:02 EDT 2017 | directx995
Hello, I'm looking for a friendly suggestions or best practices for creating Component Database. For example how do you discern different types of SOIC8, with different body size and pitch between leads? How do you categorize and name components? An
Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef
I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does
Electronics Forum | Wed Aug 07 02:24:54 EDT 2019 | ameenullakhan
Hi Dave, Yes the lead was there before reflow. After reflow it has bent inside. The component was inspected before placement. We are unable to analyze, what might have went wrong. Regards, Ameen
Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan
thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
