Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm
Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate
Electronics Forum | Sat Jul 22 04:52:31 EDT 2023 | shrikant_borkar
Here below clarification may help you I suggest you to refer IPC-AJ-820A Assembly and Joining Handbook for the entire information of applicable standards. IPC-J-STD (IPC-Joint Standard): IPC-J-STD is not a standalone standard; it refers to the serie
Electronics Forum | Wed Jun 24 13:46:41 EDT 1998 | Chris Kelly
Brian, a couple of things really stick out here... 1) You are spraying what is referred to here at the CATT as "PINK DEATH" The 3355-11 is about the most active/aggressive flux you can get your hands on. I am concerned about both the condition
Electronics Forum | Wed Sep 17 13:00:25 EDT 2008 | mw_fl
For the most part there would not be a lot of change over. There are two primary boards at this time that would be run on the line that also use common components. At this point all but a couple of the pick and place machines we have looked at have t
Electronics Forum | Tue Sep 22 09:59:15 EDT 1998 | Mike C
| Hi Jacqueline! | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | If that is true, are there many vias concentrated
Electronics Forum | Wed Sep 15 23:15:55 EDT 2004 | pdeuel
Im with Pete, Zero defects. We have high defect rate for many reasons. No line tech, operators set up and run then when QA reports defects engneers are called. Not to make people mad but our process engneers are lacking practical experance to fix pro
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Thu Apr 28 01:40:14 EDT 2022 | sophyluo1985
Advantages of SPI 1. Reduce defects SPI was first used to reduce defects caused by improperly printed solder paste. Therefore, the primary advantage of SPI is its ability to reduce defects. Defects have always been a major problem when it comes to
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
