Electronics Forum | Mon Mar 01 16:11:24 EST 1999 | Innovative Concepts
For as much as you can minimize bridging in these condition by changing board orientation, the only way to eliminate them may be to add debridging airknife tech to your system, or purchase a system that is fitted with this technology. We have been t
Electronics Forum | Thu Jul 15 12:07:36 EDT 1999 | Mark
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | There are a number of methods available. 4 of them are discu
Electronics Forum | Tue Jan 19 12:40:33 EST 1999 | Steve Moore
Bernie, Steve Gregory approach is the simplest solution. But,If you ever get yourself into a real bind and need an array of holes added and the cost of a new stencil is astronomical. Approach Hamlet at BeamOn. I have seen him add and enlarge holes on
Electronics Forum | Tue Jan 19 12:52:53 EST 1999 | Mike Vina
| Bernie, Steve Gregory approach is the simplest solution. But,If you ever get yourself into a real bind and need an array of holes added and the cost of a new stencil is astronomical. Approach Hamlet at BeamOn. I have seen him add and enlarge holes
Electronics Forum | Thu Oct 15 10:26:13 EDT 1998 | Dave Celestian
I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder mach
Electronics Forum | Fri Apr 03 03:17:03 EST 1998 | Jacqueline Coia
We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisation is i
Electronics Forum | Wed Apr 08 17:44:49 EDT 1998 | Wayne Bracy
| We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisation is
Electronics Forum | Wed Mar 11 00:09:13 EST 1998 | Fabian Morales
I haven't worked with Protecto but I have seen very good results using a no-clean flux and a nitrogen atmosphere in the reflow oven. | Entek or Protecto? | I've hear Kester's Protecto is a very good OSP that may be more assembly process-friendly th
Electronics Forum | Thu Aug 09 13:01:12 EDT 2001 | seand
Hello John, Just a thought, try contacting your equipment manufacturer. They usually see a bit of everything when it comes to applications. Maybe they can recommend a solution. Sometimes this involves purchasing something, but at least you can ta
Electronics Forum | Wed Oct 03 17:08:32 EDT 2001 | davef
No comment or intent to appear critical on your particular situation, because you did the troubleshooting to determine the source of the problem, but �solder on the component lead, but not on the pad� is more often caused by a reflow profile that get
