Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
Electronics Forum | Wed Feb 21 19:55:12 EST 2001 | davef
References on corrosion are: * "ASM Corrosion Handbook No. 13" [0871700077]. * "Electronic Packaging and Corrosion" ME Nicholson [0871702916]. Please explain how you determined that you have silver-sulfide contamination. Where is the silver comin
Electronics Forum | Fri Mar 23 09:28:46 EST 2001 | PeteC
Well, it's hard to say what it started out as, a smear, splash or ball cause the solder formation on the finger after reflow is spread out ya know. I looked at an archive for possible causes and one was printer operators with paste on their fingers.
Electronics Forum | Fri May 15 10:51:12 EDT 1998 | Justin Medernach
| We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | We have no c
Electronics Forum | Wed Dec 14 08:08:42 EST 2005 | Champ Kind
Snaggletooth, I spent a good portion of my career fighting solder shorts on BGA's and QFP's, tombstones on 0402's, solderballs on passives, etc.. I've solved just about all those issues, and didn't solely rely on my stencil manufacturer... Your ste
Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty
| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec
Electronics Forum | Sat Sep 25 08:00:11 EDT 1999 | Brian
| | | | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead termination
Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon
| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |
Electronics Forum | Mon Jan 28 16:48:14 EST 2002 | djarvis
Printing with adhesives is no big deal so don't let the sales types try to mystify the process and convince you that they have the only stencils/adhesives/knowledge that can possibly get you through this "trying time" - at a price. Start with 0.010"
Electronics Forum | Fri Dec 01 17:03:57 EST 2000 | Dave F
Curious, very curious ... Residues � Where are these residues? [solder & laminate / mask, solder only, laminate / mask only] What is the result of your analysis to the residues? How do you know it�s a flux residue, rather than a chemical by product
