Electronics Forum | Thu Nov 07 12:51:09 EST 2002 | slthomas
This is embarassing. I've used ipa (actually "70/30 rubbing" alcohol) to clean these for a better view (this is a no-clean), and found the above described anomaly to be intact. So, I assumed it was something in the solder itself. Well, today I us
Electronics Forum | Thu Jan 16 05:42:18 EST 2003 | nifhail
I've a query. I have one new Customer whom insisted us to use RMA paste on their product. The problem is, on some of their products they use via hole as the test point in where all the PCB finished are ENTEK and as usual I have to print solder paste
Electronics Forum | Thu Apr 10 19:21:02 EDT 2003 | tony_sauve
Kevin, One point that I'd like to make is that in order to get an accurate reading of the solder joint temp's you need to have the thermocouple right at the ball/PCB interface. I'd recommend precision drilling a mechanical sample of the unpopulated P
Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co
Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ
The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme
Electronics Forum | Fri May 28 13:09:42 EDT 2004 | Glenn
Thanks for the advice regarding the ultrasonic spray fluxer ... we are currently using Delta Wave 6622c wave solder machine with dual spray heads (the ability to use two completely different kinds of flux chemistries). It's a great system that works
Electronics Forum | Tue Sep 21 10:53:53 EDT 2004 | davef
We know nothing about Envivar UV 1244 and you weren't real clear about the details of the problem or the materials [eg, ws flux, solder mask, etc], but we'd speculate your adhesion problem goes back to the cleanliness of your board. First by 'alcoho
Electronics Forum | Thu Sep 23 23:42:52 EDT 2004 | KEN
The LF pastes will have virtually NO wetting spread. This is normal. LF mobilities are virtually non-existant with SAC alloys. However, the addition of varrying amounts of silver can (and does) improve mobility but, this comes with a price (paste
Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef
First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled
Electronics Forum | Wed Jul 06 16:40:05 EDT 2005 | Inds
the problem with using SAC305 is we have a very small window within which the connnector has to be removed.. otherwise Cu will dissolute. Now this process window is something between 20sec to 30 sec..depending at what temperature you are reworking th
