Electronics Forum: solder a (Page 1231 of 1481)

Solder paste softener

Electronics Forum | Sat Apr 19 10:45:43 EDT 2003 | Joe

Yngwie, In a previous life, I used a mixer made by Malcolm and was very happy with it. We used Alpha 609 WS paste and experienced no separation problems. The Malcolm equipment agitated the material in a non-concentric motion which tends to "fold

Wave soldering profiling

Electronics Forum | Wed May 12 08:27:43 EDT 2004 | solderpro

woow, looks like I need to go back on the road... you all have great info. but what happen to asking what type of machine do they currently use, what is the configuration of the machine, what type of flux are we using, are running single sided or dou

qfp reflow problems

Electronics Forum | Sat Apr 17 17:08:22 EDT 2004 | finepitch

Russ has a hint by saying "too long of a soak at too high of a temp or being in reflow for too long/hot". I think the board should stay in the oven for 3-4 minutes, spending 60-90 seconds of which during reflow. in order to stay in the oven for 3 m

X-Ray Criteria for BGA Solder Ball

Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory

It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography

X-Ray Criteria for BGA Solder Ball

Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory

It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography

Wave Soldering Thick PCBs - Foam vs Spray Fluxing

Electronics Forum | Mon Dec 27 13:26:47 EST 2004 | HOSS

Need some feedback here. We're running a foam fluxer using WS chemistry (AIM 715M). We have been running almost exclusively .062 and a few .093" PCBs but we've recently started running some boards that are .100 and .125 thickness and are having tro

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc

Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components

Screen printing Solder Mask

Electronics Forum | Fri Mar 04 15:22:17 EST 2005 | russ

Glad to hear a little success from ya Duckmann! i have stenciled mask in the past and I can tell you that stencils are expensive. They are basically a step stencil, you will need full thickness for the area(s) you are going to apply mask and you wi

ERSA versa as alternative to wave soldering in low vol high mix

Electronics Forum | Thu Sep 01 01:07:08 EDT 2005 | cmiller

We have a dual pot machine. The fluxer is not the slowest part of the process on most boards. However, we looked at running boards that had many hundreds of TH leads that we currently run through the wave in order to try not to buy a wave for lead-fr

Lead-free BOM Conversions

Electronics Forum | Tue Nov 01 10:23:22 EST 2005 | Jerry findale

I have been using a service. I search around and found that the other manufacturing services just give you cross referance parts. It cost me a lot in time and effort because the parts they cross referanced for me just turned out to be simular. We fin


solder a searches for Companies, Equipment, Machines, Suppliers & Information