Electronics Forum | Thu Jul 10 13:02:18 EDT 2014 | clydestrum
I'm not sure what happened to my post, but we think to have got the situation under control. The solder joints on the boards looked terrible. I can only describe it as unburnt flux, maybe. (like if you took a spoonful of solder and sprayed flux direc
Electronics Forum | Tue Mar 18 05:32:09 EDT 2008 | gregoryyork
What volume of boards are you putting through. 1Kg per hour does sound very high but then again it does depend on volume Using an antioxidant is a must with Lead Free some alloys have additions in them to start with but those drop out with use so th
Electronics Forum | Fri Jul 22 07:36:18 EDT 2005 | Guest
It's the same like asking wether you get a gold-contaminated solder pot when soldering ENIG boards. As long as the replenishment of dross is large compared to the intake of contaminant, the contamination level will stay within acceptable levels.
Electronics Forum | Wed Jul 30 16:16:19 EDT 2003 | swagner
What is the industry standard for wave and selective solder PPM defect rate for a world class facility, any responses are appreciated.
Electronics Forum | Tue Jan 23 16:22:01 EST 2007 | asir
I'm looking for a PbF solder paste with similar characteristic as the 63/37Pb alloy. What alloy composition would you recommend?
Electronics Forum | Thu May 28 15:54:45 EDT 2009 | elmerito
Hello, We have designed a 160ball bga substrate. Now we want to use the same substrate for the 145ball version of the product. All are the same, the package size, ball pitch, solder ball size only the number of balls will change. We will use a new s
Electronics Forum | Sun Apr 25 11:18:45 EDT 1999 | Earl Moon
| Hello all, | | Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not
Electronics Forum | Fri May 07 05:47:44 EDT 1999 | Charles Stringer
This is not strictly a surface mount query but any input welcome I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last two p
Electronics Forum | Thu Aug 10 11:32:34 EDT 2017 | dleeper
You could always take a scrap board, paste it, and let it sit out over night. Reflow it and then you should have a nice visual aid, covered in solder balls and grainy, irregularly shaped solder mounds.
Electronics Forum | Tue Jan 14 08:48:09 EST 2014 | davef
I don't know. What does your paste supplier say? You can run tests * That you used to qualify this paste in the first place. * According to IPC J-STD-005A Requirements for Soldering Pastes * Using your toughest stencil to print this paste on a bare c
