Electronics Forum: solder a (Page 1391 of 1481)

Solder Coverage in Non ROHS Paste

Electronics Forum | Tue Dec 07 17:25:28 EST 2021 | stephendo

How fast do you use your OSP boards? We don't use them but if we did I would want to try and use them the same day we open them. They are cheap but do not store well. Tin/Lead paste spreads much better than ROHS paste. If you can not always reflow

PCBA Production Manufacturing Time Control

Electronics Forum | Thu Apr 14 17:24:06 EDT 2022 | cbart

depends on board finish and PCB substrate materials. If you were using OSP or silver finished bare boards the time to process is less than an ENIG or HASL finished. certain substrate material absorb more moisture than others or at a quicker rate. so

Alternatives to CircuitCam

Electronics Forum | Tue Aug 16 14:03:00 EDT 2022 | proceng1

We currently use Aegis CircuitCam for our Production work instructions, and machine programs. I am looking for an alternative, as CC is no longer supported. We receive Gerbers (sometimes CAD files) and BOM from our customers. That is all that I can

Card board boxes in SMT

Electronics Forum | Tue Nov 29 17:18:26 EST 2022 | davef

Yes, electronics manufacturing is a volume producer of cardboard waste. If the components are ESD-critical, cardboard and most plastics are not ESD safe. Static charges can be generated on these materials during handling by the friction of dissimila

BGA Solder Short

Electronics Forum | Tue Jul 18 00:15:37 EDT 2023 | hazira1991

Is a fresh lot. This bga is old date code 2010. we had received this BGA 2021 and the baking process is done during receiving time. Production received with vacuum seal , its very hard to tell how the BGA handling and stuff and the BGA already EOL. I

Glued component location accuracy after reflow

Electronics Forum | Mon Jul 31 07:37:57 EDT 2023 | tommy_magyar

Hi Simon, Yes, red glue should help, assuming that it is being dispensed by a glue dispenser. For stencil printing I used yellow glue in the past (can't remember the brand). Your pick and place machine should be able to achieve on it's own 35 um

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 13:48:03 EDT 2023 | spoiltforchoice

Well gasketing yes, have you dine enough analysis to blame aperture design- Maybe not? Maybe whip out the gerber files for this PCB&stencil and compare the details with one you feel works well. Is there something different about their layout rules o

Improve quality with stencil design for inductor

Electronics Forum | Wed Oct 11 13:40:20 EDT 2023 | proceng1

Agreed. Your "leads" are fairly small compared to the PAD area, so you leave your part lots of room to "stretch it's legs". One thing that I have trouble communicating to my operators is that placement does not have to be perfect, and neither does t

Mirtec AOI MV-3L Solder Inspection setup

Electronics Forum | Mon Nov 20 14:48:35 EST 2023 | proceng1

Have you reached out to MIRTEC? They can easily connect through Teamviewer and check your settings and see what you see live. It would be way more effective than someone trying to troubleshoot by email. The support tech that we usually get really

What is the best IPC standard to refer to for Cleaning of Printed Board Assemblies? Thanks, Joe

Electronics Forum | Thu Mar 14 15:55:34 EDT 2024 | davef

Process Requirement Standard - J-STD-001 - Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable a


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